SLVSBM6B December   2012  â€“ November 2015 TPS22981

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Dissipation Ratings
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Current Limit
      2. 7.3.2 Current Limit Threshold
      3. 7.3.3 Maximum Current Limit Threshold
      4. 7.3.4 Transition Delays
      5. 7.3.5 Digital Control Signals
      6. 7.3.6 Overcurrent Limit and Short-Circuit Protection
      7. 7.3.7 Reverse Current Protection
      8. 7.3.8 Reverse Current Blocking
      9. 7.3.9 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 UVLO and Enable
      2. 7.4.2 FAULTZ Output
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input Inductive Bounce
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

8.1 Application Information

8.1.1 Input Inductive Bounce

When a significant inductance is seen at the VHV input, suddenly turning off large current through the device may produce a large enough inductive voltage bounce on the VHV pin to exceed the maximum safe operating condition and damage the TPS22981. To prevent this, reduce any inductance at the VHV input.

8.2 Typical Application

TPS22981 typapp_lvsbm6.gif Figure 9. Typical Application Schematic

8.2.1 Design Requirements

As the TPS22981 switches high-current levels, it is essential that all parallel output, power, and ground pins be connected. For example, ground connections must be provided on all ground pins including pins 1, 2, 3, 13, 15, and EP (the exposed package pad); both OUT pins (pins 12 and 14) must be connected; and so forth. RSET_S0, RSET_S3, and RSET_V3P3 must be determined using Equation 1. Unused inputs may not be left floating and should be connected to either ground or V3P3 depending on desired behavior.

8.2.2 Detailed Design Procedure

Design with TPS22981 is recommended as follows:

  • Determine suitable current limits for the low-voltage and high-voltage output levels (output provided on the OUT pin). If S0 is being used, determine both high-voltage output levels and current-limiting values.
  • Determine values for the resistors to be applied to pins ISET_V3P3, ISET_S3, and ISET_S0 using Equation 1 and the desired current limits determined above.
  • If the FAULTZ output is being used, place a minimum 30-kΩ resistor (100-kΩ recommended) between FAULTZ and the V3P3.