SLVSCL4B August   2014  – September 2014 TPS22994

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Recommended Operating Conditions
    2. 8.2 Absolute Maximum Ratings
    3. 8.3 Handling Ratings
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Switching Characteristics, VBIAS = 7.2 V
    7. 8.7 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Operating Frequency
      2. 9.3.2  SDA/SCL Pin Configuration
      3. 9.3.3  Address (ADDx) Pin Configuration
      4. 9.3.4  On-Delay Control
      5. 9.3.5  Slew Rate Control
      6. 9.3.6  Quick Output Discharge (QOD) Control
      7. 9.3.7  Mode Registers
      8. 9.3.8  SwitchALL™ Command
      9. 9.3.9  VDD Supply For I2C Operation
      10. 9.3.10 Input Capacitor (Optional)
      11. 9.3.11 Output Capacitor (Optional)
      12. 9.3.12 I2C Protocol
        1. 9.3.12.1 Start and Stop Bit
        2. 9.3.12.2 Auto-increment Bit
        3. 9.3.12.3 Write Command
        4. 9.3.12.4 Read Command
        5. 9.3.12.5 SwitchALLTM Command
    4. 9.4 Device Functional Modes
      1. 9.4.1 I2C Control
      2. 9.4.2 GPIO Control
    5. 9.5 Register Map
  10. 10Applications and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Input Capacitor (Optional)
      2. 10.1.2 Output Capacitor (Optional)
      3. 10.1.3 Switch from GPIO Control to I2C Control (and vice versa)
      4. 10.1.4 Configuration of Configuration Registers
        1. 10.1.4.1 Single Register Configuration
        2. 10.1.4.2 Multi-register Configuration (Consecutive Registers)
      5. 10.1.5 Configuration of Mode Registers
      6. 10.1.6 Turn-on/Turn-off of Channels
    2. 10.2 Typical Application
      1. 10.2.1 Tying Multiple Channels in Parallel
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
        3. 10.2.1.3 Application Curves
      2. 10.2.2 Cold Boot Programming of All Registers
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curves
      3. 10.2.3 Power Sequencing Without I2C
        1. 10.2.3.1 Design Requirements
          1. 10.2.3.1.1 Reading From the Registers
        2. 10.2.3.2 Detailed Design Procedure
          1. 10.2.3.2.1 VIN to VOUT Voltage Drop
          2. 10.2.3.2.2 Inrush Current
        3. 10.2.3.3 Application Curves
  11. 11Layout
    1. 11.1 Board Layout
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Pin Configuration and Functions

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