SLVSG05A October   2021  – December 2021 TPS22998

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics (VBIAS = 5 V)
    6. 6.6  Electrical Characteristics (VBIAS = 3.3 V)
    7. 6.7  Electrical Characteristics (VBIAS = 2.2 V)
    8. 6.8  Switching Characteristics (VBIAS = 2.2 V to 5 V)
    9. 6.9  Timing Diagram
    10. 6.10 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 ON and OFF Control
      2. 7.3.2 Adjustable Slew Rate
      3. 7.3.3 Thermal Shutdown
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Performance Plots
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC (1) TPS22998 UNIT
RYZ (WQFN)
10 PINS
RθJA Junction-to-ambient thermal resistance 84.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 77.5 °C/W
RθJB Junction-to-board thermal resistance 16.6 °C/W
ΨJT Junction-to-top characterization parameter 4.0 °C/W
YJB Junction-to-board characterization parameter 16.0 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.