SLUSCM4B October   2017  – November 2018 TPS2372

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 PG Power Good (Converter Enable) Pin Interface
      2. 7.3.2 CLSA and CLSB Classification, AUTCLS
      3. 7.3.3 DEN Detection and Enable
      4. 7.3.4 Internal Pass MOSFET and Inrush Delay Enable, IRSHDL_EN
      5. 7.3.5 TPH, TPL and BT PSE Type Indicators
      6. 7.3.6 AMPS_CTL, MPS_DUTY and Automatic MPS
      7. 7.3.7 VDD Supply Voltage
      8. 7.3.8 VSS
      9. 7.3.9 Exposed Thermal PAD
    4. 7.4 Device Functional Modes
      1. 7.4.1  PoE Overview
      2. 7.4.2  Threshold Voltages
      3. 7.4.3  PoE Startup Sequence
      4. 7.4.4  Detection
      5. 7.4.5  Hardware Classification
      6. 7.4.6  Autoclass
      7. 7.4.7  Inrush and Startup
      8. 7.4.8  Maintain Power Signature
      9. 7.4.9  Startup and Converter Operation
      10. 7.4.10 PD Hotswap Operation
      11. 7.4.11 Startup and Power Management, PG and TPH, TPL, BT
      12. 7.4.12 Using DEN to Disable PoE
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Requirements
        1. 8.2.2.1  Input Bridges and Schottky Diodes
        2. 8.2.2.2  Protection, D1
        3. 8.2.2.3  Capacitor, C1
        4. 8.2.2.4  Detection Resistor, RDEN
        5. 8.2.2.5  Classification Resistors, RCLSA and RCLSB
        6. 8.2.2.6  Opto-isolators for TPH, TPL and BT
        7. 8.2.2.7  Automatic MPS and MPS Duty Cycle, RMPS and RMPS_DUTY
        8. 8.2.2.8  Internal Voltage Reference, RREF
        9. 8.2.2.9  Autoclass
        10. 8.2.2.10 Inrush Delay
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 EMI Containment
    4. 10.4 Thermal Considerations and OTSD
    5. 10.5 ESD
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Links
      2. 11.1.2 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

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