SLVSDW2B
December 2018 – November 2020
TPS23755
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics: DC-DC Controller Section
6.6
Electrical Characteristics: PoE and Control
6.7
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
CLS Classification
7.3.2
DEN Detection and Enable
7.3.3
Internal Pass MOSFET
7.3.4
DC-DC Controller Features
7.3.4.1
VCC, VB and Advanced PWM Startup
7.3.4.2
CS, Current Slope Compensation and Blanking
7.3.4.3
COMP, FB, CP and Opto-less Feedback
7.3.4.4
FRS Frequency Setting and Synchronization
7.3.4.5
Frequency Dithering for Spread Spectrum Applications
7.3.4.6
SST and Soft-Start of the Switcher
7.3.4.7
AUX_V, AUX_D and Secondary Adapter Or'ing
7.3.5
Internal Switching FET - DRAIN, RSNS, SRF and SRR
7.3.6
VPD Supply Voltage
7.3.7
VDD Supply Voltage
7.3.8
GND
7.3.9
VSS
7.3.10
Exposed Thermal PAD
7.4
Device Functional Modes
7.4.1
PoE Overview
7.4.2
Threshold Voltages
7.4.3
PoE Start-Up Sequence
7.4.4
Detection
7.4.5
Hardware Classification
7.4.6
Maintain Power Signature (MPS)
7.4.7
Start-Up and Converter Operation
7.4.8
PD Self-Protection
7.4.9
Adapter ORing
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.2.1
Input Bridges and Schottky Diodes
8.2.2.2
Protection, D1
8.2.2.3
Capacitor, C1
8.2.2.4
Detection Resistor, RDEN
8.2.2.5
Classification Resistor, RCLS
8.2.2.6
Bulk Capacitance, CBULK
8.2.2.7
Output Voltage Feedback Divider, RAUX, R1,R2
8.2.2.8
Setting Frequency, RFRS
8.2.2.9
Frequency Dithering, RDTR and CDTR
8.2.2.10
Bias Voltage, CVB and DVB
8.2.2.11
Transformer design, T1
8.2.2.12
Current Sense Resistor, RCS
8.2.2.13
Current Slope Compensation, RS
8.2.2.14
Bias Supply Requirements, CCC, DCC
8.2.2.15
Switching Transformer Considerations, RVCC and CCC2
8.2.2.16
Primary FET Clamping, RCL, CCL, and DCL
8.2.2.17
Converter Output Capacitance, COUT
8.2.2.18
Secondary Output Diode Rectifier, DOUT
8.2.2.19
Slew rate control, RSRF and RSRR
8.2.2.20
Shutdown at Low Temperatures, DVDD and CVDD
8.2.3
Application Curves
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
11
Device and Documentation Support
11.1
Related documentation
11.2
Support Resources
11.3
Trademarks
11.4
Electrostatic Discharge Caution
11.5
Glossary
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
RJJ|23
Thermal pad, mechanical data (Package|Pins)
Orderable Information
slvsdw2b_oa
slvsdw2b_pm
11.5
Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.