SLVSHI5 April   2024 TPS23881B

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
    1. 5.1 Detailed Pin Description
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Timing Diagrams
  9. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1 Operating Modes
        1. 8.1.1.1 Auto
        2. 8.1.1.2 Semiauto
        3. 8.1.1.3 Manual and Diagnostic
        4. 8.1.1.4 Power Off
      2. 8.1.2 PoE Compliance Terminology
      3. 8.1.3 Channel versus Port Terminology
      4. 8.1.4 Requested Class versus Assigned Class
      5. 8.1.5 Power Allocation and Power Demotion
      6. 8.1.6 Programmable SRAM
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Port Remapping
      2. 8.3.2 Port Power Priority
      3. 8.3.3 Analog-to-Digital Converters (ADC)
      4. 8.3.4 I2C Watchdog
      5. 8.3.5 Current Foldback Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Detection
      2. 8.4.2 Connection Check
      3. 8.4.3 Classification
      4. 8.4.4 DC Disconnect
    5. 8.5 I2C Programming
      1. 8.5.1 I2C Serial Interface
    6. 8.6 Register Maps
      1. 8.6.1 Complete Register Set
      2. 8.6.2 Detailed Register Descriptions
        1. 8.6.2.1  INTERRUPT Register
        2. 8.6.2.2  INTERRUPT MASK Register
        3. 8.6.2.3  POWER EVENT Register
        4. 8.6.2.4  DETECTION EVENT Register
        5. 8.6.2.5  FAULT EVENT Register
        6. 8.6.2.6  START/ILIM EVENT Register
        7. 8.6.2.7  SUPPLY and FAULT EVENT Register
          1. 8.6.2.7.1 Detected SRAM Faults and "Safe Mode"
        8. 8.6.2.8  CHANNEL 1 DISCOVERY Register
        9. 8.6.2.9  CHANNEL 2 DISCOVERY Register
        10. 8.6.2.10 CHANNEL 3 DISCOVERY Register
        11. 8.6.2.11 CHANNEL 4 DISCOVERY Register
        12. 8.6.2.12 POWER STATUS Register
        13. 8.6.2.13 PIN STATUS Register
        14. 8.6.2.14 OPERATING MODE Register
        15. 8.6.2.15 DISCONNECT ENABLE Register
        16. 8.6.2.16 DETECT/CLASS ENABLE Register
        17. 8.6.2.17 Power Priority / 2Pair PCUT Disable Register Name
        18. 8.6.2.18 TIMING CONFIGURATION Register
        19. 8.6.2.19 GENERAL MASK Register
        20. 8.6.2.20 DETECT/CLASS RESTART Register
        21. 8.6.2.21 POWER ENABLE Register
        22. 8.6.2.22 RESET Register
        23. 8.6.2.23 ID Register
        24. 8.6.2.24 Connection Check and Auto Class Status Register
        25. 8.6.2.25 2-Pair Police Ch-1 Configuration Register
        26. 8.6.2.26 2-Pair Police Ch-2 Configuration Register
        27. 8.6.2.27 2-Pair Police Ch-3 Configuration Register
        28. 8.6.2.28 2-Pair Police Ch-4 Configuration Register
        29. 8.6.2.29 Capacitance (Legacy PD) Detection
        30. 8.6.2.30 Power-on Fault Register
        31. 8.6.2.31 PORT RE-MAPPING Register
        32. 8.6.2.32 Channels 1 and 2 Multi Bit Priority Register
        33. 8.6.2.33 Channels 3 and 4 Multi Bit Priority Register
        34. 8.6.2.34 4-Pair Wired and Port Power Allocation Register
        35. 8.6.2.35 4-Pair Police Ch-1 and 2 Configuration Register
        36. 8.6.2.36 4-Pair Police Ch-3 and 4 Configuration Register
        37. 8.6.2.37 TEMPERATURE Register
        38. 8.6.2.38 4-Pair Fault Configuration Register
        39. 8.6.2.39 INPUT VOLTAGE Register
        40. 8.6.2.40 CHANNEL 1 CURRENT Register
        41. 8.6.2.41 CHANNEL 2 CURRENT Register
        42. 8.6.2.42 CHANNEL 3 CURRENT Register
        43. 8.6.2.43 CHANNEL 4 CURRENT Register
        44. 8.6.2.44 CHANNEL 1 VOLTAGE Register
        45. 8.6.2.45 CHANNEL 2 VOLTAGE Register
        46. 8.6.2.46 CHANNEL 3 VOLTAGE Register
        47. 8.6.2.47 CHANNEL 4 VOLTAGE Register
        48. 8.6.2.48 2x FOLDBACK SELECTION Register
        49. 8.6.2.49 FIRMWARE REVISION Register
        50. 8.6.2.50 I2C WATCHDOG Register
        51. 8.6.2.51 DEVICE ID Register
        52. 8.6.2.52 CHANNEL 1 DETECT RESISTANCE Register
        53. 8.6.2.53 CHANNEL 2 DETECT RESISTANCE Register
        54. 8.6.2.54 CHANNEL 3 DETECT RESISTANCE Register
        55. 8.6.2.55 CHANNEL 4 DETECT RESISTANCE Register
        56. 8.6.2.56 CHANNEL 1 DETECT CAPACITANCE Register
        57. 8.6.2.57 CHANNEL 2 DETECT CAPACITANCE Register
        58. 8.6.2.58 CHANNEL 3 DETECT CAPACITANCE Register
        59. 8.6.2.59 CHANNEL 4 DETECT CAPACITANCE Register
        60. 8.6.2.60 CHANNEL 1 ASSIGNED CLASS Register
        61. 8.6.2.61 CHANNEL 2 ASSIGNED CLASS Register
        62. 8.6.2.62 CHANNEL 3 ASSIGNED CLASS Register
        63. 8.6.2.63 CHANNEL 4 ASSIGNED CLASS Register
        64. 8.6.2.64 AUTO CLASS CONTROL Register
        65. 8.6.2.65 CHANNEL 1 AUTO CLASS POWER Register
        66. 8.6.2.66 CHANNEL 2 AUTO CLASS POWER Register
        67. 8.6.2.67 CHANNEL 3 AUTO CLASS POWER Register
        68. 8.6.2.68 CHANNEL 4 AUTO CLASS POWER Register
        69. 8.6.2.69 ALTERNATIVE FOLDBACK Register
        70. 8.6.2.70 SRAM CONTROL Register
          1. 8.6.2.70.1 SRAM START ADDRESS (LSB) Register
          2. 8.6.2.70.2 SRAM START ADDRESS (MSB) Register
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Introduction to PoE
        1. 9.1.1.1 2-Pair Versus 4-Pair Power and the New IEEE802.3bt Standard
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Connections on Unused Channels
        2. 9.2.2.2 Power Pin Bypass Capacitors
        3. 9.2.2.3 Per Port Components
        4. 9.2.2.4 System Level Components (not Shown in the Schematic Diagrams)
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 VDD
      2. 9.3.2 VPWR
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 Kelvin Current Sensing Resistors
      2. 9.4.2 Layout Example
        1. 9.4.2.1 Component Placement and Routing Guidelines
          1. 9.4.2.1.1 Power Pin Bypass Capacitors
          2. 9.4.2.1.2 Per-Port Components
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2.2.3 Per Port Components

  • CPn: 0.1-μF, 100-V, X7R ceramic between VPWR and Pn-.
  • RSn: Each channels current sense resistor is a 0.2-Ω. A 1%, 0.25-W resistor in an 0805 SMT package is recommended. If a 90W Policing (PCUT) threshold is selected, the maximum power dissipation for the resistor becomes approximately 140 mW.
  • QPn: The port MOSFET can be a small, inexpensive device with average performance characteristics. BVDSS must be 100-V minimum. Target a MOSFET RDS(on) at VGS = 10 V of between 50 mΩ and 150 mΩ. The MOSFET GATE charge (QG) and input capacitance (CISS) should be less than 50 nC and 2000 pF respectively. The maximum power dissipation for QPn with RDS(on) = 100 mΩ at 640 mA nominal policing (ICUT) threshold is approximately 45 mW.
    Note:

    In addition to the MOSFET RDS(on) and BVDSS characteristics, the power MOSFET SOA ratings also must be taken into consideration when selecting these components for your system design. TI recommends that a MOSFET be chosen with an SOA rating that exceeds the inrush and operational foldback characteristic curves as shown in Figure 8-2 and Figure 8-3. When using the standard current foldback (ALTIRn or ALTFBn = 0) options, TI recommends the CSD19538Q3A 100-V N-Channel MOSFET.

  • FPn: The port fuse must be a slow blow type rated for at least 60 VDC and above approximately 2 × PCUT (maximum). The cold resistance must be below 200 mΩ to reduce the DC losses. The power dissipation for FPn with a cold resistance of 180 mΩ at maximum PCUT is approximately 150 mW.
  • DPnA: The port TVS must be rated for the expected port surge environment. DPnA must have a minimum reverse standoff voltage of 58 V and a maximum clamping voltage of less than 95 V at the expected peak surge current.