SLVSAL2G January   2011  – November 2015 TPS24710 , TPS24711 , TPS24712 , TPS24713

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 DETAILED PIN DESCRIPTIONS
        1. 8.3.1.1  EN
        2. 8.3.1.2  FLT
        3. 8.3.1.3  FLTb
        4. 8.3.1.4  GATE
        5. 8.3.1.5  GND
        6. 8.3.1.6  OUT
        7. 8.3.1.7  PG
        8. 8.3.1.8  PGb
        9. 8.3.1.9  PROG
        10. 8.3.1.10 SENSE
        11. 8.3.1.11 TIMER
        12. 8.3.1.12 VCC
    4. 8.4 Device Functional Modes
      1. 8.4.1 Board Plug In
      2. 8.4.2 Inrush Operation
      3. 8.4.3 Action of the Constant-Power Engine
      4. 8.4.4 Circuit Breaker and Fast Trip
      5. 8.4.5 Automatic Restart
      6. 8.4.6 PG, FLT, PGb, FLTb, and Timer Operations
      7. 8.4.7 Overtemperature Shutdown
      8. 8.4.8 Start-Up of Hot-Swap Circuit by VCC or EN
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Power-Limited Start-Up
          1. 9.2.2.1.1 STEP 1. Choose RSENSE
          2. 9.2.2.1.2 STEP 2. Choose MOSFET M1
          3. 9.2.2.1.3 STEP 3. Choose Power-Limit Value, PLIM, and RPROG
          4. 9.2.2.1.4 STEP 4. Choose Output Voltage Rising Time, tON, CT
          5. 9.2.2.1.5 STEP 5. Calculate the Retry-Mode Duty Ratio
          6. 9.2.2.1.6 STEP 6. Select R1 and R2 for UV
          7. 9.2.2.1.7 STEP 7. Choose RGATE, R4, R5 and C1
        2. 9.2.2.2 Additional Design Considerations
          1. 9.2.2.2.1 Use of PG/PGb
          2. 9.2.2.2.2 Output Clamp Diode
          3. 9.2.2.2.3 Gate Clamp Diode
          4. 9.2.2.2.4 High-Gate-Capacitance Applications
          5. 9.2.2.2.5 Bypass Capacitors
          6. 9.2.2.2.6 Output Short-Circuit Measurements
          7. 9.2.2.2.7 Using Soft Start with TPS2471x
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
    2. 12.2 Related Links
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Layout

11.1 Layout Guidelines

TPS24710/11/12/13 applications require careful attention to layout to ensure proper performance and to minimize susceptibility to transients and noise. In general, all traces should be as short as possible, but the following list deserves first consideration:

  • Decoupling capacitors on VCC pin should have minimal trace lengths to the pin and to GND.
  • Traces to VCC and SENSE must be short and run side-by-side to maximize common-mode rejection. Kelvin connections should be used at the points of contact with RSENSE. (see Figure 39).
  • Power path connections should be as short as possible and sized to carry at least twice the full load current, more if possible.
  • Protection devices such as snubbers, TVS, capacitors, or diodes should be placed physically close to the device they are intended to protect, and routed with short traces to reduce inductance. For example, the protection Schottky diode shown in the typical application diagram on the front page of this data sheet should be physically close to the OUT pin.

11.2 Layout Example

TPS24710 TPS24711 TPS24712 TPS24713 M0217-02_LVSAL2.gif Figure 39. Recommended RSENSE Layout