SLVSBY8D May   2013  – June 2020 TPS2513 , TPS2513A , TPS2514 , TPS2514A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Device Options
  6. 6 Pin Configuration and Functions
    1.     Pin Functions: TPS2513x
    2.     Pin Functions: TPS2514x
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Dedicated Charging Port (DCP)
      2. 8.3.2 Short the D+ Line to the D– Line
      3. 8.3.3 Divider DCP
      4. 8.3.4 Applying 1.2 V to the D+ Line and 1.2 V to the D– Line
      5. 8.3.5 DCP Auto-Detect
      6. 8.3.6 Undervoltage Lockout (UVLO)
    4. 8.4 Device Functional Modes
  9. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Divide Mode Selection of 5-W and 10-W USB Chargers
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) TPS2513x, TPS2514x UNIT
DBV (SOT-23)
6 PINS
RθJA Junction-to-ambient thermal resistance 179.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 117.5 °C/W
RθJB Junction-to-board thermal resistance 41.9 °C/W
ψJT Junction-to-top characterization parameter 17.2 °C/W
ψJB Junction-to-board characterization parameter 41.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report.