SLVSCJ0E March   2014  – June 2021 TPS25200

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Enable
      2. 8.3.2 Thermal Sense
      3. 8.3.3 Overcurrent Protection
      4. 8.3.4 FAULT Response
      5. 8.3.5 Output Discharge
    4. 8.4 Device Functional Modes
      1. 8.4.1 Undervoltage Lockout (UVLO)
      2. 8.4.2 Overcurrent Protection (OCP)
      3. 8.4.3 Overvoltage Clamp (OVC)
      4. 8.4.4 Overvoltage Lockout (OVLO)
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Step by Step Design Produce
        2. 9.2.2.2 Input and Output Capacitance
        3. 9.2.2.3 Programming the Current-Limit Threshold
        4. 9.2.2.4 Design Above a Minimum Current Limit
        5. 9.2.2.5 Design Below a Maximum Current Limit
        6. 9.2.2.6 Power Dissipation and Junction Temperature
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.7 Typical Characteristics

GUID-A8D16159-C06D-4BC4-999F-708A23D3D99B-low.png
RILIM = 33 KΩ
Figure 6-1 IIN(on) vs Junction Temperature
GUID-5CB19F22-E702-48DF-AF0B-B57D5AAA91D2-low.png
VEN = VIN = 0 V
Figure 6-3 IREV vs Junction Temperature
GUID-0B85011D-F0E5-44FF-B299-402FD58203AA-low.png
VEN = VIN = 0 V
Figure 6-5 V(OVLO) vs Junction Temperature
GUID-C32B2F1F-D6F3-4BD7-B98E-C11D31C4E322-low.pngFigure 6-7 IOS vs Junction Temperature
GUID-D8DA92EC-122C-43A0-ACEC-0CF6C6119E21-low.png
RILIM = 33 KΩ
Figure 6-2 IIN(off) vs Junction Temperature
GUID-206CF1CF-42BD-4FA3-9011-5D2852311712-low.pngFigure 6-4 rDS(ON) vs Junction Temperature
GUID-18E2C03B-746D-442C-BB06-AAE6EB60C509-low.png
CL = 1 µFRL = 100 ΩVIN = 6.5 V
Figure 6-6 VO(VC) vs Junction Temperature
GUID-5F0CEDD7-1921-4C02-B543-342182B784AF-low.pngFigure 6-8 Discharge Resistance vs VIN