SLUSCP2 September   2016 TPS2549

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  FAULT Response
      2. 8.3.2  Cable Compensation
        1. 8.3.2.1 Design Procedure
      3. 8.3.3  D+ and D- Protection
      4. 8.3.4  Output and D+ or D- Discharge
      5. 8.3.5  Port Power Management (PPM)
        1. 8.3.5.1 Benefits of PPM
        2. 8.3.5.2 PPM Details
        3. 8.3.5.3 Implementing PPM in a System With Two Charging Ports (CDP and SDP1)
        4. 8.3.5.4 Implementing PPM in a System With Two Charging Ports (DCP and DCP1)
      6. 8.3.6  CDP and SDP Auto Switch
      7. 8.3.7  Overcurrent Protection
      8. 8.3.8  Undervoltage Lockout
      9. 8.3.9  Thermal Sensing
      10. 8.3.10 Current Limit Setting
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Truth Table (TT)
      2. 8.4.2 USB Specification Overview
      3. 8.4.3 Standard Downstream Port (SDP) Mode — USB 2.0 and USB 3.0
      4. 8.4.4 Charging Downstream Port (CDP) Mode
      5. 8.4.5 Dedicated Charging Port (DCP) Mode
        1. 8.4.5.1 DCP BC1.2 and YD/T 1591-2009
        2. 8.4.5.2 DCP Divider-Charging Scheme
        3. 8.4.5.3 DCP 1.2-V Charging Scheme
      6. 8.4.6 DCP Auto Mode
      7. 8.4.7 Client Mode
      8. 8.4.8 High-Bandwidth Data-Line Switches
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Input and Output Capacitance
        2. 9.2.2.2 Cable Compensation Calculation
        3. 9.2.2.3 Power Dissipation and Junction Temperature
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

RTE Package
16-Pin WQFN
Top View

Pin Functions

PIN TYPE(1) DESCRIPTION
NAME NO.
CS 4 O Provide sink current proportional to output current. For cable compensation, connect to the feedback divider of the up-stream voltage regulator.
CTL1 6 I Logic-level control inputs for controlling the charging mode and the signal switches; (see Table 2). These pins tie directly to IN or GND without a pullup or pulldown resistor.
CTL2 7 I
CTL3 8 I
DM_IN 11 I/O D– data line to downstream connector
DM_OUT 2 I/O D– data line to upstream USB host controller
DP_IN 10 I/O D+ data line to downstream connector
DP_OUT 3 I/O D+ data line to upstream USB host controller
EN 5 I Logic-level control input for turning the power switch and the signal switches on/off. When EN is low, the device is disabled, the signal and power switches are OFF.
FAULT 13 O Active-low open-drain output, asserted during overtemperature, overcurrent, and DP_IN and DM_IN overvoltage conditions. See Table 1.
GND 14 — Ground connection; should be connected externally to the thermal pad.
ILIM_HI 16 I Connect external resistor to ground to set the high current-limit threshold.
ILIM_LO 15 I Connect external resistor to ground to set the low current-limit threshold and the load-detection current threshold.
IN 1 PWR Input supply voltage; connect a 0.1 µF or greater ceramic capacitor from IN to GND as close to the IC as possible.
OUT 12 PWR Power-switch output
STATUS 9 O Active-low open-drain output, asserted when the load exceeds the load-detection threshold
Thermal pad — — Thermal pad on bottom of package. The thermal pad is internally connected to GND and is used to heat-sink the device to the circuit board. Connect the thermal pad to the GND plane.
(1) I = Input, O = Output, I/O = Input and output, PWR = Power