SLVSC97B March   2014  – September 2020 TPS2556-Q1 , TPS2557-Q1

PRODUCTION DATA  

  1. Features
  2. Application
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Terminal Configuration and Functions
    1.     Terminal Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
      1.      16
        1.       Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Overcurrent Conditions
      2. 8.3.2 FAULT Response
      3. 8.3.3 Thermal Sense
    4. 8.4 Device Functional Modes
      1. 8.4.1 Undervoltage Lockout (UVLO)
      2. 8.4.2 Enable ( EN OR EN)
      3. 8.4.3 Auto-Retry Functionality
      4. 8.4.4 Two-Level Current-Limit Circuit
  9. Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application, Design for Current Limit
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Determine Design Parameters
        2. 9.2.2.2 Programming the Current-Limit Threshold
        3. 9.2.2.3 Selecting Current-Limit Resistor 1
        4. 9.2.2.4 Selecting Current-Limit Resistor 2
        5. 9.2.2.5 Accounting for Resistor Tolerance
        6. 9.2.2.6 Power Dissipation and Junction Temperature
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.