SLVSC97B March   2014  – September 2020 TPS2556-Q1 , TPS2557-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Application
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Terminal Configuration and Functions
    1.     Terminal Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
      1.      16
        1.       Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Overcurrent Conditions
      2. 8.3.2 FAULT Response
      3. 8.3.3 Thermal Sense
    4. 8.4 Device Functional Modes
      1. 8.4.1 Undervoltage Lockout (UVLO)
      2. 8.4.2 Enable ( EN OR EN)
      3. 8.4.3 Auto-Retry Functionality
      4. 8.4.4 Two-Level Current-Limit Circuit
  9. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application, Design for Current Limit
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Determine Design Parameters
        2. 9.2.2.2 Programming the Current-Limit Threshold
        3. 9.2.2.3 Selecting Current-Limit Resistor 1
        4. 9.2.2.4 Selecting Current-Limit Resistor 2
        5. 9.2.2.5 Accounting for Resistor Tolerance
        6. 9.2.2.6 Power Dissipation and Junction Temperature
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.5 Electrical Characteristics

over recommended operating conditions, VEN = 0 V, or VEN = VIN (unless otherwise noted)
PARAMETER TEST CONDITIONS(1) MIN TYP MAX UNIT
POWER SWITCH
rDS(on) Static drain-source on-state resistance TJ = 25°C 22 25 mΩ
–40 °C ≤ TJ ≤ 125°C 35
ENABLE INPUT EN OR EN
Enable terminal turnon or turnoff threshold 0.66 1.1 V
Hysteresis 55(2) mV
I(EN) Input current V(EN) = 0 V or 6.5 V, or V( EN) = 0 V or 6.5 V –0.5 0.5 μA
CURRENT LIMIT
IOS Current-limit threshold (maximum dc output current I(OUT) delivered to load) and short-circuit current, OUT connected to GND R(ILIM) = 24.9 kΩ 4180 4500 4745 mA
R(ILIM) = 61.9 kΩ 1610 1805 1980
R(ILIM) = 100 kΩ 945 1110 1270
SUPPLY CURRENT
I(IN_off) Supply current, low-level output V(IN) = 6.5 V, no load on OUT, V( EN) = 6.5 V or V(EN) = 0 V 0.1 2.5 μA
I(IN_on) Supply current, high-level output V(IN) = 6.5 V, no load on OUT R(ILIM) = 24.9 kΩ 95 120 μA
R(ILIM) = 100 kΩ 85 110 μA
I(REV) Reverse leakage current V(OUT) = 6.5 V, VIN = 0 V TJ = 25 °C 0.01 1 μA
UNDERVOLTAGE LOCKOUT
V(UVLO) Low-level input voltage, IN V(IN) rising 2.35 2.45 V
Hysteresis, IN 35(2) mV
FAULT FLAG
VOL Output low voltage, FAULT I( FAULT) = 1 mA 180 mV
Off-state leakage V( FAULT) = 6.5 V 1 μA
FAULT deglitch FAULT assertion or de-assertion due to overcurrent condition 6 9 13 ms
THERMAL SHUTDOWN
T(OTSD2) Thermal shutdown threshold 155 °C
T(OTSD) Thermal shutdown threshold in current-limit 135 °C
Hysteresis 20(2) °C
(1) Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately.
(2) These parameters are provided for reference only, and do no constitute part of TI's published specifications for purposes of TI's product warranty.