SLVSGP9 October   2023 TPS25730

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
      1. 6.1.1 TPS25730D and TPS25730S - Absolute Maximum Ratings
      2. 6.1.2 TPS25730D - Absolute Maximum Ratings
      3. 6.1.3 TPS25730S - Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
      1. 6.3.1 TPS25730D - Recommended Operating Conditions
      2. 6.3.2 TPS25730S - Recommended Operating Conditions
    4. 6.4  Recommended Capacitance
    5. 6.5  Thermal Information
      1. 6.5.1 TPS25730D - Thermal Information
      2. 6.5.2 TPS25730S - Thermal Information
    6. 6.6  Power Supply Characteristics
    7. 6.7  Power Consumption
    8. 6.8  PPHV Power Switch Characteristics - TPS25730D
    9. 6.9  PP_EXT Power Switch Characteristics - TPS25730S
    10. 6.10 Power Path Supervisory
    11. 6.11 CC Cable Detection Parameters
    12. 6.12 CC PHY Parameters
    13. 6.13 Thermal Shutdown Characteristics
    14. 6.14 ADC Characteristics
    15. 6.15 Input/Output (I/O) Characteristics
    16. 6.16 I2C Requirements and Characteristics
    17. 6.17 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  USB-PD Physical Layer
        1. 8.3.1.1 USB-PD Encoding and Signaling
        2. 8.3.1.2 USB-PD Bi-Phase Marked Coding
        3. 8.3.1.3 USB-PD BMC Transmitter
        4. 8.3.1.4 USB-PD BMC Receiver
        5. 8.3.1.5 Squelch Receiver
      2. 8.3.2  Power Management
        1. 8.3.2.1 Power-On And Supervisory Functions
        2. 8.3.2.2 VBUS LDO
      3. 8.3.3  Power Paths
        1. 8.3.3.1 TPS25730D Internal Sink Path
        2. 8.3.3.2 TPS25730S - External Sink Path Control PP_EXT
      4. 8.3.4  Cable Plug and Orientation Detection
      5. 8.3.5  Overvoltage Protection (CC1, CC2)
      6. 8.3.6  Default Behavior Configuration (ADCIN1, ADCIN2)
      7. 8.3.7  ADC
      8. 8.3.8  Digital Interfaces
      9. 8.3.9  Digital Core
      10. 8.3.10 I2C Interface
        1. 8.3.10.1 I2C Interface Description
          1. 8.3.10.1.1 I2C Clock Stretching
          2. 8.3.10.1.2 Unique Address Interface
          3. 8.3.10.1.3 Pin Strapping to Configure Default Behavior
      11. 8.3.11 Minimum Voltage Configuration
      12. 8.3.12 Maximum Voltage Configuration
      13. 8.3.13 Sink Current Configuration
      14. 8.3.14 Autonegotiate Sink Minimum Power
      15. 8.3.15 Extended Sink Capabilities Power Delivery Power
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power States
    5. 8.5 Schottky for Current Surge Protection
    6. 8.6 Thermal Shutdown
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Supported Sink Power Configurations
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 3.3-V Power
        1. 9.3.1.1 VIN_3V3 Input Switch
      2. 9.3.2 1.5-V Power
      3. 9.3.3 Recommended Supply Load Capacitance
    4. 9.4 Layout
      1. 9.4.1 TPS25730D - Layout
        1. 9.4.1.1 Layout Guidelines
          1. 9.4.1.1.1 Top Placement and Bottom Component Placement and Layout
        2. 9.4.1.2 Layout Example
        3. 9.4.1.3 Component Placement
        4. 9.4.1.4 Routing VBUS, VIN_3V3, LDO_3V3, LDO_1V5
        5. 9.4.1.5 Routing CC and GPIO
      2. 9.4.2 TPS25730S - Layout
        1. 9.4.2.1 Layout Guidelines
          1. 9.4.2.1.1 Top Placement and Bottom Component Placement and Layout
        2. 9.4.2.2 Layout Example
        3. 9.4.2.3 Component Placement
        4. 9.4.2.4 Routing VBUS, PPHV, VIN_3V3, LDO_3V3, LDO_1V5
        5. 9.4.2.5 Routing CC and GPIO
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5.1 TPS25730D - Thermal Information

THERMAL METRIC(1)TPS25730DUNIT
QFN
38 PINS
RθJAJunction-to-ambient thermal resistance (sinking through PP_HV)57.4°C/W
RθJC (top)Junction-to-case (top) thermal resistance (sinking through PP_HV)30.5°C/W
RθJBJunction-to-board thermal resistance (sinking through PP_HV)21.1°C/W
ψJTJunction-to-top characterization parameter (sinking through PP_HV)18.2°C/W
ψJBJunction-to-board characterization parameter (sinking through PP_HV)21.1°C/W
RθJC (bot_GND)Junction-to-case (bottom GND pad) thermal resistance1.8°C/W
RθJC (bot_DRAIN)Junction-to-case (bottom DRAIN pad) thermal resistance4.6°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.