SLVSGP9 October   2023 TPS25730

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
      1. 6.1.1 TPS25730D and TPS25730S - Absolute Maximum Ratings
      2. 6.1.2 TPS25730D - Absolute Maximum Ratings
      3. 6.1.3 TPS25730S - Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
      1. 6.3.1 TPS25730D - Recommended Operating Conditions
      2. 6.3.2 TPS25730S - Recommended Operating Conditions
    4. 6.4  Recommended Capacitance
    5. 6.5  Thermal Information
      1. 6.5.1 TPS25730D - Thermal Information
      2. 6.5.2 TPS25730S - Thermal Information
    6. 6.6  Power Supply Characteristics
    7. 6.7  Power Consumption
    8. 6.8  PPHV Power Switch Characteristics - TPS25730D
    9. 6.9  PP_EXT Power Switch Characteristics - TPS25730S
    10. 6.10 Power Path Supervisory
    11. 6.11 CC Cable Detection Parameters
    12. 6.12 CC PHY Parameters
    13. 6.13 Thermal Shutdown Characteristics
    14. 6.14 ADC Characteristics
    15. 6.15 Input/Output (I/O) Characteristics
    16. 6.16 I2C Requirements and Characteristics
    17. 6.17 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  USB-PD Physical Layer
        1. 8.3.1.1 USB-PD Encoding and Signaling
        2. 8.3.1.2 USB-PD Bi-Phase Marked Coding
        3. 8.3.1.3 USB-PD BMC Transmitter
        4. 8.3.1.4 USB-PD BMC Receiver
        5. 8.3.1.5 Squelch Receiver
      2. 8.3.2  Power Management
        1. 8.3.2.1 Power-On And Supervisory Functions
        2. 8.3.2.2 VBUS LDO
      3. 8.3.3  Power Paths
        1. 8.3.3.1 TPS25730D Internal Sink Path
        2. 8.3.3.2 TPS25730S - External Sink Path Control PP_EXT
      4. 8.3.4  Cable Plug and Orientation Detection
      5. 8.3.5  Overvoltage Protection (CC1, CC2)
      6. 8.3.6  Default Behavior Configuration (ADCIN1, ADCIN2)
      7. 8.3.7  ADC
      8. 8.3.8  Digital Interfaces
      9. 8.3.9  Digital Core
      10. 8.3.10 I2C Interface
        1. 8.3.10.1 I2C Interface Description
          1. 8.3.10.1.1 I2C Clock Stretching
          2. 8.3.10.1.2 Unique Address Interface
          3. 8.3.10.1.3 Pin Strapping to Configure Default Behavior
      11. 8.3.11 Minimum Voltage Configuration
      12. 8.3.12 Maximum Voltage Configuration
      13. 8.3.13 Sink Current Configuration
      14. 8.3.14 Autonegotiate Sink Minimum Power
      15. 8.3.15 Extended Sink Capabilities Power Delivery Power
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power States
    5. 8.5 Schottky for Current Surge Protection
    6. 8.6 Thermal Shutdown
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Supported Sink Power Configurations
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 3.3-V Power
        1. 9.3.1.1 VIN_3V3 Input Switch
      2. 9.3.2 1.5-V Power
      3. 9.3.3 Recommended Supply Load Capacitance
    4. 9.4 Layout
      1. 9.4.1 TPS25730D - Layout
        1. 9.4.1.1 Layout Guidelines
          1. 9.4.1.1.1 Top Placement and Bottom Component Placement and Layout
        2. 9.4.1.2 Layout Example
        3. 9.4.1.3 Component Placement
        4. 9.4.1.4 Routing VBUS, VIN_3V3, LDO_3V3, LDO_1V5
        5. 9.4.1.5 Routing CC and GPIO
      2. 9.4.2 TPS25730S - Layout
        1. 9.4.2.1 Layout Guidelines
          1. 9.4.2.1.1 Top Placement and Bottom Component Placement and Layout
        2. 9.4.2.2 Layout Example
        3. 9.4.2.3 Component Placement
        4. 9.4.2.4 Routing VBUS, PPHV, VIN_3V3, LDO_3V3, LDO_1V5
        5. 9.4.2.5 Routing CC and GPIO
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.12 CC PHY Parameters

Operating under these conditions unless otherwise noted: and ( 3.0 V ≤ VVIN_3V3 ≤ 3.6 V or VVBUS ≥ 3.9 V )
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
Transmitter
VTXHITransmit high voltage on CCyStandard External load 1.051.1251.2V
VTXLOTransmit low voltage on CCyStandard External load –7575mV
ZDRIVERTransmit output impedance while driving the CC line using CCymeasured at 750 kHz335475Ω
tRiseRise time. 10 % to 90 % amplitude points on CCy, minimum is under an unloaded condition. Maximum set by TX maskCCCy = 520 pF300ns
tFallFall time. 90 % to 10 % amplitude points on CCy, minimum is under an unloaded condition. Maximum set by TX maskCCCy = 520 pF300ns
VPHY_OVPOVP detection threshold for USB PD PHY0 ≤ VVIN_3V3 ≤ 3.6 V, VVBUS ≥ 4 V. Initially VCC1 ≤ 5.5 V and VCC2 ≤ 5.5 V, then VCCx rises5.58.5V
Receiver
ZBMCRXReceiver input impedance on CCyDoes not include pullup or pulldown resistance from cable detect. Transmitter is Hi-Z1MΩ
CCCReceiver capacitance on CCy(1)Capacitance looking into the CC pin when in receiver mode120pF
VRX_SNK_RRising threshold on CCy for receiver comparatorSink mode (rising) 499525551mV
VRX_SRC_RRising threshold on CCy for receiver comparatorSource mode (rising) 784825866mV
VRX_SNK_FFalling threshold on CCy for receiver comparatorSink mode (falling) 230250270mV
VRX_SRC_FFalling threshold on CCy for receiver comparatorSource mode (falling) 523550578mV
(1) CCC includes only the internal capacitance on a CCy pin when the pin is configured to be receiving BMC data. External capacitance is needed to meet the required minimum capacitance per the USB-PD Specifications (cReceiver). Therefore, TI recommends adding CCCy externally.