SLVSDG8B April   2016  – June 2017 TPS25740 , TPS25740A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1 VBUS Capacitance
      2. 8.1.2 USB Data Communications
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  USB Type-C CC Logic (CC1, CC2)
      2. 8.3.2  USB PD BMC Transmission (CC1, CC2, VTX)
      3. 8.3.3  USB PD BMC Reception (CC1, CC2)
      4. 8.3.4  Discharging (DSCG, VPWR)
        1. 8.3.4.1 Discharging after a Fault (VPWR)
      5. 8.3.5  Configuring Voltage Capabilities (HIPWR, EN9V, EN12V)
      6. 8.3.6  Configuring Power Capabilities (PSEL, PCTRL, HIPWR)
      7. 8.3.7  Gate Driver (GDNG, GDNS)
      8. 8.3.8  Fault Monitoring and Protection
        1. 8.3.8.1 Over/Under Voltage (VBUS)
        2. 8.3.8.2 Over-Current Protection (ISNS, VBUS)
        3. 8.3.8.3 System Fault Input (GD, VPWR)
      9. 8.3.9  Voltage Control (CTL1, CTL2)
      10. 8.3.10 Sink Attachment Indicator (UFP, DVDD)
      11. 8.3.11 Power Supplies (VAUX, VDD, VPWR, DVDD)
      12. 8.3.12 Grounds (AGND, GND)
      13. 8.3.13 Output Power Supply (DVDD)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Sleep Mode
      2. 8.4.2 Checking VBUS at Start Up
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 System-Level ESD Protection
      2. 9.1.2 Use of GD Internal Clamp
      3. 9.1.3 Resistor Divider on GD for Programmable Start Up
      4. 9.1.4 Selection of the CTL1 and CTL2 Resistors (R(FBL1) and R(FBL2))
      5. 9.1.5 Voltage Transition Requirements
      6. 9.1.6 VBUS Slew Control using GDNG C(SLEW)
      7. 9.1.7 Tuning OCP Using RF and CF
    2. 9.2 Typical Application , A/C Power Source (Wall Adapter)
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Power Pin Bypass Capacitors
        2. 9.2.2.2 Non-Configurable Components
        3. 9.2.2.3 Configurable Components
      3. 9.2.3 Application Curves
      4. 9.2.4 Typical Application, D/C Power Source
        1. 9.2.4.1 Design Requirements
        2. 9.2.4.2 Detailed Design Procedure
          1. 9.2.4.2.1 Power Pin Bypass Capacitors
          2. 9.2.4.2.2 Non-Configurable Components
          3. 9.2.4.2.3 Configurable Components
        3. 9.2.4.3 Application Curves
    3. 9.3 System Examples
      1. 9.3.1 D/C Power Source (Power Hub)
      2. 9.3.2 A/C Power Source (Wall Adapter)
      3. 9.3.3 Dual-Port Power Managed A/C Power Source (Wall Adaptor)
      4. 9.3.4 D/C Power Source (Power Hub with 3.3 V Rail)
  10. 10Power Supply Recommendations
    1. 10.1 VDD
    2. 10.2 VPWR
  11. 11Layout
    1. 11.1 Port Current Kelvin Sensing
    2. 11.2 Layout Guidelines
      1. 11.2.1 Power Pin Bypass Capacitors
      2. 11.2.2 Supporting Components
    3. 11.3 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Documentation Support

USB PD and USB Type-C specifications available at: http://www.usb.org/home

TPS25740EVM-741 and TPS25740AEVM-741 EVM User's Guide

TPS25740/TPS25740A Design Calculator Tool

12.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 11. Related Links

PARTS PRODUCT FOLDER ORDER NOW TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
TPS25740 Click here Click here Click here Click here Click here
TPS25740A Click here Click here Click here Click here Click here

12.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

12.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.5 Trademarks

E2E is a trademark of Texas Instruments.

12.6 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.