SLVSDR6C
June 2017 – March 2018
TPS25740B
PRODUCTION DATA.
1
Features
2
Applications
3
Description
Device Images
Simplified Schematic
4
Revision History
5
Device Comparison Table
6
Pin Configuration and Functions
Pin Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
Timing Requirements
7.7
Switching Characteristics
7.8
Typical Characteristics
8
Detailed Description
8.1
Overview
8.1.1
VBUS Capacitance
8.1.2
USB Data Communications
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
ENSRC
8.3.2
USB Type-C CC Logic (CC1, CC2)
8.3.3
USB PD BMC Transmission (CC1, CC2, VTX)
8.3.4
USB PD BMC Reception (CC1, CC2)
8.3.5
Discharging (DSCG, VPWR)
8.3.5.1
Discharging after a Fault (VPWR)
8.3.6
Configuring Voltage Capabilities (HIPWR)
8.3.7
Configuring Power Capabilities (PSEL, PCTRL, HIPWR)
8.3.8
Gate Driver (GDNG, GDNS)
8.3.9
Fault Monitoring and Protection
8.3.9.1
Over/Under Voltage (VBUS)
8.3.9.2
Over-Current Protection (ISNS, VBUS)
8.3.9.3
System Fault Input (GD, VPWR)
8.3.10
Voltage Control (CTL1, CTL2,CTL3)
8.3.11
Sink Attachment Indicator (DVDD)
8.3.12
Power Supplies (VAUX, VDD, VPWR, DVDD)
8.3.13
Grounds (AGND, GND)
8.3.14
Output Power Supply (DVDD)
8.4
Device Functional Modes
8.4.1
Sleep Mode
8.4.2
Checking VBUS at Start Up
9
Application and Implementation
9.1
Application Information
9.1.1
System-Level ESD Protection
9.1.2
Using ENSRC to Enable the Power Supply upon Sink Attachment
9.1.3
Use of GD Internal Clamp
9.1.4
Resistor Divider on GD for Programmable Start Up
9.1.5
Selection of the CTL1, CTL2, and CTL3 Resistors (R(FBL1), R(FBL2), and R(FBL3))
9.1.6
Voltage Transition Requirements
9.1.7
VBUS Slew Control using GDNG C(SLEW)
9.1.8
Tuning OCP using RF and CF
9.2
Typical Applications
9.2.1
Typical Application, A/C Power Source (Wall Adapter)
9.2.1.1
Design Requirements
9.2.1.2
Detailed Design Procedure
9.2.1.2.1
Power Pin Bypass Capacitors
9.2.1.2.2
Non-Configurable Components
9.2.1.2.3
Configurable Components
9.2.1.3
Application Curves
9.2.2
Typical Application, D/C Power Source
9.2.2.1
Design Requirements
9.2.2.2
Detailed Design Procedure
9.2.2.2.1
Power Pin Bypass Capacitors
9.2.2.2.2
Non-Configurable Components
9.2.2.2.3
Configurable Components
9.2.2.3
Application Curves
9.3
System Examples
9.3.1
D/C Power Source (Power Hub)
9.3.2
A/C Power Source (Wall Adapter)
9.3.3
Dual-Port A/C Power Source (Wall Adaptor)
9.3.4
D/C Power Source (Power Hub with 3.3 V Rail)
10
Power Supply Recommendations
10.1
VDD
10.2
VPWR
11
Layout
11.1
Port Current Kelvin Sensing
11.2
Layout Guidelines
11.2.1
Power Pin Bypass Capacitors
11.2.2
Supporting Components
11.3
Layout Example
12
Device and Documentation Support
12.1
Documentation Support
12.2
Receiving Notification of Documentation Updates
12.3
Community Resources
12.4
Trademarks
12.5
Electrostatic Discharge Caution
12.6
Glossary
13
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
RGE|24
MPQF124G
Thermal pad, mechanical data (Package|Pins)
RGE|24
QFND136Y
Orderable Information
slvsdr6c_oa
slvsdr6c_pm
1
Features
USB PD 2.0 Certified (TID# 1030004) and USB PD 3.0 Compliant Provider
Pin-Selectable Voltage Advertisement
5 V, 9 V, 12 V, and 15 V
5 V, 9 V, 15 V, and 20 V
Pin-Selectable Peak Power Settings
8 Options 18 W – 100 W
High Voltage and Safety Integration
Overvoltage, Overcurrent, Overtemperature Protection and V
BUS
Discharge
IEC 61000-4-2 Protection on CC1 and CC2
Input Pin for Fast Shutdown Under Fault
Control of External N-ch MOSFET
3-Pin External Power Supply Control
Wide VIN Supply (4.65 V – 25 V)
Below 10 µA Quiescent Current When Unattached
Port Attachment Indicator
Self-Directed Port Power Management for Dual-Port Applications