SLVSGO0 October   2024 TPS25763-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Recommended Components
    5. 6.5  Thermal Information
    6. 6.6  Buck-Boost Regulator
    7. 6.7  CC Cable Detection Parameters
    8. 6.8  CC VCONN Parameters
    9. 6.9  CC PHY Parameters
    10. 6.10 Thermal Shutdown Characteristics
    11. 6.11 Oscillator Characteristics
    12. 6.12 ADC Characteristics
    13. 6.13 TVSP Parameters
    14. 6.14 Input/Output (I/O) Characteristics
    15. 6.15 BC1.2 Characteristics
    16. 6.16 I2C Requirements and Characteristics
    17. 6.17 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Device Power Management and Supervisory Circuitry
        1. 8.3.1.1 VIN UVLO and Enable/UVLO
        2. 8.3.1.2 Internal LDO Regulators
      2. 8.3.2  TVSP Device Configuration and ESD Protection
      3. 8.3.3  External NFET and LSGD
      4. 8.3.4  Buck-Boost Regulator
        1. 8.3.4.1  Buck-Boost Regulator Operation
        2. 8.3.4.2  Switching Frequency, Frequency Dither, Phase-Shift and Synchronization
        3. 8.3.4.3  VIN Supply and VIN Over-Voltage Protection
        4. 8.3.4.4  Feedback Paths and Error Amplifiers
        5. 8.3.4.5  Transconductors and Compensation
        6. 8.3.4.6  Output Voltage DAC, Soft-Start and Cable Droop Compensation
        7. 8.3.4.7  VBUS Overvoltage Protection
        8. 8.3.4.8  VBUS Undervoltage Protection
        9. 8.3.4.9  Current Sense Resistor (RSNS) and Current Limit Operation
        10. 8.3.4.10 Buck-Boost Peak Current Limits
      5. 8.3.5  USB-PD Physical Layer
        1. 8.3.5.1 USB-PD Encoding and Signaling
        2. 8.3.5.2 USB-PD Bi-Phase Marked Coding
        3. 8.3.5.3 USB-PD Transmit (TX) and Receive (Rx) Masks
        4. 8.3.5.4 USB-PD BMC Transmitter
        5. 8.3.5.5 USB-PD BMC Receiver
        6. 8.3.5.6 Squelch Receiver
      6. 8.3.6  VCONN
      7. 8.3.7  Cable Plug and Orientation Detection
        1. 8.3.7.1 Configured as a Source
        2. 8.3.7.2 Configured as a Sink
        3. 8.3.7.3 Configured as a DRP
        4. 8.3.7.4 Overvoltage Protection (Px_CC1, Px_CC2)
      8. 8.3.8  ADC
        1. 8.3.8.1 ADC Divider Ratios
      9. 8.3.9  BC 1.2, Legacy and Fast Charging Modes (Px_DP, Px_DM)
      10. 8.3.10 DisplayPort Hot-Plug Detect (HPD)
      11. 8.3.11 USB2.0 Low-Speed Endpoint
      12. 8.3.12 Digital Interfaces
        1. 8.3.12.1 General GPIO
        2. 8.3.12.2 I2C Buffer
      13. 8.3.13 I2C Interface
        1. 8.3.13.1 I2C Interface Description
        2. 8.3.13.2 I2C Clock Stretching
        3. 8.3.13.3 I2C Address Setting
        4. 8.3.13.4 Unique Address Interface
        5. 8.3.13.5 I2C Pullup Resistor Calculation
      14. 8.3.14 Digital Core
        1. 8.3.14.1 Device Memory
        2. 8.3.14.2 Core Microprocessor
      15. 8.3.15 NTC Input
      16. 8.3.16 Thermal Sensors and Thermal Shutdown
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Application GUI Selections
        2. 9.2.2.2 EEPROM Selection
        3. 9.2.2.3 EN/UVLO
        4. 9.2.2.4 Sense Resistor, RSNS, RCSP, RCSN and CFILT
        5. 9.2.2.5 Inductor Currents
        6. 9.2.2.6 Output Capacitor
        7. 9.2.2.7 Input Capacitor
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1.     106

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RQL|29
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2 Typical Application

Figure 9-3 Shows a typical example of a 65 W output automotive USB Type-C Power Delivery port. The device is internally compensated and optimized for components shown in Table 9-1.

TPS25763-Q1 TPS25763-Q1 Application Schematic Figure 9-3 TPS25763-Q1 Application Schematic
Table 9-1 Recommended Inductors, Input and Output Capacitance
fSW CIN + CHF L MIN of COUT + CBUS COUT + CHF CBUS
300 22 µF + 2 × 0.1 µF 4.7 µH 160 µF 30 µF + 2 × 0.1 µF 130 µF + 2 × 0.1 µF
400 22 µF + 2 ×0.1 µF 4.7 µH 120 µF 30 µF + 2 × 0.1 µF 90 µF + 2 × 0.1 µF
400 22 µF + 2 × 0.1 µF 3.3 µH 140 µF 30 µF + 2 × 0.1 µF 110 µF + 2 × 0.1 µF
450 22 µF + 2 × 0.1 µF 3.3 µH 140 µF 30 µF + 2 × 0.1 µF 110 µF + 2 × 0.1 µF
  • 50 V rated capacitors recommended.
TPS25763-Q1 Input and Output CHF Capacitor Placement Figure 9-4 Input and Output CHF Capacitor Placement

To ensure adequate decoupling of VIN and VOUT and robust device operation, use two 0.1 μF, CHF capacitors per node, placed on opposite sides of the IC package, as close to the pins as possible. Typically, the inductor is placed on the same PCB layer (top or bottom) as the IC package. The CHF capacitors on the inductor end of the IC package may be placed on the opposite side of the PCB (bottom or top) using vias to minimize trace length from the inductor side IN and OUT pins to the physical location of these capacitors.

Table 9-2 Recommended SWx Snubber and Current Sense Filter Components
SW1 (1) SW2 (2) CSP & CSN Filter (3)
RSNB (0.25 W) CSNB (50 V) RSNB (0.25 W) CSNB (50 V) RCSP (0.1 W) RCSN (0.1 W) CFLT (50 V)
2.2 Ω || 2.2 Ω 1 nF 2.2 Ω || 2.2 Ω 3.3 nF 10 Ω 0 Ω 0.22 μF
  1. As needed for EMI mitigation - user optional. (Use of this snubber can also aid in supporting devices with high initial inrush load current that exceeds the power delivery specification.)
  2. Required for robust device operation.
  3. Required to meet USB-IF current regulation requirements.