SLVSGO0 October   2024 TPS25763-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Recommended Components
    5. 6.5  Thermal Information
    6. 6.6  Buck-Boost Regulator
    7. 6.7  CC Cable Detection Parameters
    8. 6.8  CC VCONN Parameters
    9. 6.9  CC PHY Parameters
    10. 6.10 Thermal Shutdown Characteristics
    11. 6.11 Oscillator Characteristics
    12. 6.12 ADC Characteristics
    13. 6.13 TVSP Parameters
    14. 6.14 Input/Output (I/O) Characteristics
    15. 6.15 BC1.2 Characteristics
    16. 6.16 I2C Requirements and Characteristics
    17. 6.17 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Device Power Management and Supervisory Circuitry
        1. 8.3.1.1 VIN UVLO and Enable/UVLO
        2. 8.3.1.2 Internal LDO Regulators
      2. 8.3.2  TVSP Device Configuration and ESD Protection
      3. 8.3.3  External NFET and LSGD
      4. 8.3.4  Buck-Boost Regulator
        1. 8.3.4.1  Buck-Boost Regulator Operation
        2. 8.3.4.2  Switching Frequency, Frequency Dither, Phase-Shift and Synchronization
        3. 8.3.4.3  VIN Supply and VIN Over-Voltage Protection
        4. 8.3.4.4  Feedback Paths and Error Amplifiers
        5. 8.3.4.5  Transconductors and Compensation
        6. 8.3.4.6  Output Voltage DAC, Soft-Start and Cable Droop Compensation
        7. 8.3.4.7  VBUS Overvoltage Protection
        8. 8.3.4.8  VBUS Undervoltage Protection
        9. 8.3.4.9  Current Sense Resistor (RSNS) and Current Limit Operation
        10. 8.3.4.10 Buck-Boost Peak Current Limits
      5. 8.3.5  USB-PD Physical Layer
        1. 8.3.5.1 USB-PD Encoding and Signaling
        2. 8.3.5.2 USB-PD Bi-Phase Marked Coding
        3. 8.3.5.3 USB-PD Transmit (TX) and Receive (Rx) Masks
        4. 8.3.5.4 USB-PD BMC Transmitter
        5. 8.3.5.5 USB-PD BMC Receiver
        6. 8.3.5.6 Squelch Receiver
      6. 8.3.6  VCONN
      7. 8.3.7  Cable Plug and Orientation Detection
        1. 8.3.7.1 Configured as a Source
        2. 8.3.7.2 Configured as a Sink
        3. 8.3.7.3 Configured as a DRP
        4. 8.3.7.4 Overvoltage Protection (Px_CC1, Px_CC2)
      8. 8.3.8  ADC
        1. 8.3.8.1 ADC Divider Ratios
      9. 8.3.9  BC 1.2, Legacy and Fast Charging Modes (Px_DP, Px_DM)
      10. 8.3.10 DisplayPort Hot-Plug Detect (HPD)
      11. 8.3.11 USB2.0 Low-Speed Endpoint
      12. 8.3.12 Digital Interfaces
        1. 8.3.12.1 General GPIO
        2. 8.3.12.2 I2C Buffer
      13. 8.3.13 I2C Interface
        1. 8.3.13.1 I2C Interface Description
        2. 8.3.13.2 I2C Clock Stretching
        3. 8.3.13.3 I2C Address Setting
        4. 8.3.13.4 Unique Address Interface
        5. 8.3.13.5 I2C Pullup Resistor Calculation
      14. 8.3.14 Digital Core
        1. 8.3.14.1 Device Memory
        2. 8.3.14.2 Core Microprocessor
      15. 8.3.15 NTC Input
      16. 8.3.16 Thermal Sensors and Thermal Shutdown
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Application GUI Selections
        2. 9.2.2.2 EEPROM Selection
        3. 9.2.2.3 EN/UVLO
        4. 9.2.2.4 Sense Resistor, RSNS, RCSP, RCSN and CFILT
        5. 9.2.2.5 Inductor Currents
        6. 9.2.2.6 Output Capacitor
        7. 9.2.2.7 Input Capacitor
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1.     106

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RQL|29
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.7.1 Configured as a Source

When Port A is configured as a Source, the device detects when a cable or a Sink is attached using the Px_CC1 and Px_CC2 pins. When in a disconnected state, the device monitors the voltages on these pins to determine what, if anything, is connected. See USB Type-C Specification for more information.

Table 8-5 shows the Cable Detect States for a Source.

Table 8-5 Cable Detect States for a Source
Px_CC1Px_CC2CONNECTION STATERESULTING ACTION
OpenOpenNothing attachedContinue monitoring both Px_CCy pins for attach. Power is not applied to Px_VBUS or VCONN.
RdOpenSink attachedMonitor Px_CC1 for detach. Power is applied to Px_VBUS but not to VCONN (Px_CC2).
OpenRdSink attachedMonitor Px_CC2 for detach. Power is applied to Px_VBUS but not to VCONN (Px_CC1).
RaOpenPowered Cable-No UFP attachedMonitor Px_CC2 for a Sink attach and Px_CC1 for cable detach. Power is not applied to Px_VBUS or VCONN (Px_CC1).
OpenRaPowered Cable-No UFP attachedMonitor Px_CC1 for a Sink attach and Px_CC2 for cable detach. Power is not applied to Px_VBUS or VCONN (Px_CC2).
RaRdPowered Cable-UFP AttachedProvide power on Px_VBUS and VCONN (Px_CC1) then monitor Px_CC2 for a Sink detach. Px_CC1 is not monitored for a detach.
RdRaPowered Cable-UFP attachedProvide power on Px_VBUS and VCONN (Px_CC2) then monitor Px_CC1 for a Sink detach. Px_CC2 is not monitored for a detach.

When a port is configured as a Source, a current IRp1.5A, is driven out of each Px_CCy pin and each pin is monitored for different states. When a Sink is attached to the port a pull-down resistance of Rd to GND exists. The current IRp1.5A is then forced across the resistance Rd generating a voltage at the Px_CCy pin. The device applies the configured IRp1.5A until the buck-boost regulator is enabled and operating at 5 V, at which time application firmware may remain at IRp1.5A or change to IRp3.0A.

When the Px_CCy pin is connected to an electronically marked cable VCONN input, the pull-down resistance is different (Ra). In this case the voltage on the Px_CCy pin pulls below VRDstd and the system recognizes the electronically marked cable.

The VDstd1.5 or VD3.0 threshold is monitored to detect a disconnection depending upon which Rp current source is active. When a connection has been recognized and the voltage on Px_CCy subsequently rises above the disconnect threshold for tCC, the system registers a disconnection.

TPS25763-Q1 Type-C Cable Figure 8-29 Type-C Cable