SLVSGO0 October   2024 TPS25763-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Recommended Components
    5. 6.5  Thermal Information
    6. 6.6  Buck-Boost Regulator
    7. 6.7  CC Cable Detection Parameters
    8. 6.8  CC VCONN Parameters
    9. 6.9  CC PHY Parameters
    10. 6.10 Thermal Shutdown Characteristics
    11. 6.11 Oscillator Characteristics
    12. 6.12 ADC Characteristics
    13. 6.13 TVSP Parameters
    14. 6.14 Input/Output (I/O) Characteristics
    15. 6.15 BC1.2 Characteristics
    16. 6.16 I2C Requirements and Characteristics
    17. 6.17 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Device Power Management and Supervisory Circuitry
        1. 8.3.1.1 VIN UVLO and Enable/UVLO
        2. 8.3.1.2 Internal LDO Regulators
      2. 8.3.2  TVSP Device Configuration and ESD Protection
      3. 8.3.3  External NFET and LSGD
      4. 8.3.4  Buck-Boost Regulator
        1. 8.3.4.1  Buck-Boost Regulator Operation
        2. 8.3.4.2  Switching Frequency, Frequency Dither, Phase-Shift and Synchronization
        3. 8.3.4.3  VIN Supply and VIN Over-Voltage Protection
        4. 8.3.4.4  Feedback Paths and Error Amplifiers
        5. 8.3.4.5  Transconductors and Compensation
        6. 8.3.4.6  Output Voltage DAC, Soft-Start and Cable Droop Compensation
        7. 8.3.4.7  VBUS Overvoltage Protection
        8. 8.3.4.8  VBUS Undervoltage Protection
        9. 8.3.4.9  Current Sense Resistor (RSNS) and Current Limit Operation
        10. 8.3.4.10 Buck-Boost Peak Current Limits
      5. 8.3.5  USB-PD Physical Layer
        1. 8.3.5.1 USB-PD Encoding and Signaling
        2. 8.3.5.2 USB-PD Bi-Phase Marked Coding
        3. 8.3.5.3 USB-PD Transmit (TX) and Receive (Rx) Masks
        4. 8.3.5.4 USB-PD BMC Transmitter
        5. 8.3.5.5 USB-PD BMC Receiver
        6. 8.3.5.6 Squelch Receiver
      6. 8.3.6  VCONN
      7. 8.3.7  Cable Plug and Orientation Detection
        1. 8.3.7.1 Configured as a Source
        2. 8.3.7.2 Configured as a Sink
        3. 8.3.7.3 Configured as a DRP
        4. 8.3.7.4 Overvoltage Protection (Px_CC1, Px_CC2)
      8. 8.3.8  ADC
        1. 8.3.8.1 ADC Divider Ratios
      9. 8.3.9  BC 1.2, Legacy and Fast Charging Modes (Px_DP, Px_DM)
      10. 8.3.10 DisplayPort Hot-Plug Detect (HPD)
      11. 8.3.11 USB2.0 Low-Speed Endpoint
      12. 8.3.12 Digital Interfaces
        1. 8.3.12.1 General GPIO
        2. 8.3.12.2 I2C Buffer
      13. 8.3.13 I2C Interface
        1. 8.3.13.1 I2C Interface Description
        2. 8.3.13.2 I2C Clock Stretching
        3. 8.3.13.3 I2C Address Setting
        4. 8.3.13.4 Unique Address Interface
        5. 8.3.13.5 I2C Pullup Resistor Calculation
      14. 8.3.14 Digital Core
        1. 8.3.14.1 Device Memory
        2. 8.3.14.2 Core Microprocessor
      15. 8.3.15 NTC Input
      16. 8.3.16 Thermal Sensors and Thermal Shutdown
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Application GUI Selections
        2. 9.2.2.2 EEPROM Selection
        3. 9.2.2.3 EN/UVLO
        4. 9.2.2.4 Sense Resistor, RSNS, RCSP, RCSN and CFILT
        5. 9.2.2.5 Inductor Currents
        6. 9.2.2.6 Output Capacitor
        7. 9.2.2.7 Input Capacitor
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1.     106

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RQL|29
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.7.3 Configured as a DRP

When the TPS25763-Q1 port is configured as a DRP, the device alternates the port's Px_CCy pins between the pull-down resistance, Rd, and pull-up current source, Rp.

When in DRP mode as required to be DisplayPort-compliant when Alt Mode is enabled, VBUS must be detected when the TPS25763-Q1 port is operating as a power sink. In this state, the OUT pin is disconnected from VBUS by the blocking FET and VBUS is sensed though a bypass resistor connected across the blocking FET as shown in External NFET and Load-Switch Gate Drive (LSGD) Connection.

Note it is possible to configure the TPS25763-Q1 as a source-only and enable DisplayPort Alt Mode. In this configuration, the bypass resistor is not needed for VBUS sense and the TPS25763-Q1 operates as a source, providing VBUS to the port when attached. This configuration can be selected based on use-case and system-level requirements.