SLVSGO0 October   2024 TPS25763-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Recommended Components
    5. 6.5  Thermal Information
    6. 6.6  Buck-Boost Regulator
    7. 6.7  CC Cable Detection Parameters
    8. 6.8  CC VCONN Parameters
    9. 6.9  CC PHY Parameters
    10. 6.10 Thermal Shutdown Characteristics
    11. 6.11 Oscillator Characteristics
    12. 6.12 ADC Characteristics
    13. 6.13 TVSP Parameters
    14. 6.14 Input/Output (I/O) Characteristics
    15. 6.15 BC1.2 Characteristics
    16. 6.16 I2C Requirements and Characteristics
    17. 6.17 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Device Power Management and Supervisory Circuitry
        1. 8.3.1.1 VIN UVLO and Enable/UVLO
        2. 8.3.1.2 Internal LDO Regulators
      2. 8.3.2  TVSP Device Configuration and ESD Protection
      3. 8.3.3  External NFET and LSGD
      4. 8.3.4  Buck-Boost Regulator
        1. 8.3.4.1  Buck-Boost Regulator Operation
        2. 8.3.4.2  Switching Frequency, Frequency Dither, Phase-Shift and Synchronization
        3. 8.3.4.3  VIN Supply and VIN Over-Voltage Protection
        4. 8.3.4.4  Feedback Paths and Error Amplifiers
        5. 8.3.4.5  Transconductors and Compensation
        6. 8.3.4.6  Output Voltage DAC, Soft-Start and Cable Droop Compensation
        7. 8.3.4.7  VBUS Overvoltage Protection
        8. 8.3.4.8  VBUS Undervoltage Protection
        9. 8.3.4.9  Current Sense Resistor (RSNS) and Current Limit Operation
        10. 8.3.4.10 Buck-Boost Peak Current Limits
      5. 8.3.5  USB-PD Physical Layer
        1. 8.3.5.1 USB-PD Encoding and Signaling
        2. 8.3.5.2 USB-PD Bi-Phase Marked Coding
        3. 8.3.5.3 USB-PD Transmit (TX) and Receive (Rx) Masks
        4. 8.3.5.4 USB-PD BMC Transmitter
        5. 8.3.5.5 USB-PD BMC Receiver
        6. 8.3.5.6 Squelch Receiver
      6. 8.3.6  VCONN
      7. 8.3.7  Cable Plug and Orientation Detection
        1. 8.3.7.1 Configured as a Source
        2. 8.3.7.2 Configured as a Sink
        3. 8.3.7.3 Configured as a DRP
        4. 8.3.7.4 Overvoltage Protection (Px_CC1, Px_CC2)
      8. 8.3.8  ADC
        1. 8.3.8.1 ADC Divider Ratios
      9. 8.3.9  BC 1.2, Legacy and Fast Charging Modes (Px_DP, Px_DM)
      10. 8.3.10 DisplayPort Hot-Plug Detect (HPD)
      11. 8.3.11 USB2.0 Low-Speed Endpoint
      12. 8.3.12 Digital Interfaces
        1. 8.3.12.1 General GPIO
        2. 8.3.12.2 I2C Buffer
      13. 8.3.13 I2C Interface
        1. 8.3.13.1 I2C Interface Description
        2. 8.3.13.2 I2C Clock Stretching
        3. 8.3.13.3 I2C Address Setting
        4. 8.3.13.4 Unique Address Interface
        5. 8.3.13.5 I2C Pullup Resistor Calculation
      14. 8.3.14 Digital Core
        1. 8.3.14.1 Device Memory
        2. 8.3.14.2 Core Microprocessor
      15. 8.3.15 NTC Input
      16. 8.3.16 Thermal Sensors and Thermal Shutdown
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Application GUI Selections
        2. 9.2.2.2 EEPROM Selection
        3. 9.2.2.3 EN/UVLO
        4. 9.2.2.4 Sense Resistor, RSNS, RCSP, RCSN and CFILT
        5. 9.2.2.5 Inductor Currents
        6. 9.2.2.6 Output Capacitor
        7. 9.2.2.7 Input Capacitor
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1.     106

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RQL|29
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.14 Input/Output (I/O) Characteristics

Typical values correspond to TJ = 25°C. Minimum and maximum limits apply over the –40°C to 150°C junction temperature range unless otherwise stated.VIN = 13.5 V, EN =2 V, unless otherwise stated.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
GPIO0-9 (Inputs) (1)
VIH GPIOx high-Level input voltage 1.3 V
VIL GPIOx low-level input voltage 0.54 V
GPIOx input hysteresis voltage 0.09 V
II(LEAKAGE) GPIOx leakage current VGPIOx = 5.5 V –8 8 µA
RPU GPIOx internal pull-up pull-up enabled 50 100 150 kΩ
RPD GPIOx internal pull-down pull-down enabled 50 100 150 kΩ
tDG GPIOx input deglitch 20 ns
GPIO 2, 3, 5, 6 (Outputs)
VOH GPIOx output high voltage IGPIOx= -5mA 2.9 V
VOL GPIOx output low voltage IGPIOx=5mA 0.4 V
GPIO 0, 1, 4, 7, 8, 9 (Outputs) (2)
VOH GPIOx output high voltage IGPIOx= -2mA 2.9 V
VOL GPIOx output low voltage IGPIOx=2mA 0.4 V
SYNC OUT 
ϕ shift_00 GPIOx when configured as phase shifted DC/DC fsw clock output Phase difference between fsw and GPIO6 when configured as SYNC(O). 0 degrees
ϕ shift_90 GPIOx when configured as phase shifted DC/DC fsw clock output Phase difference between fsw and GPIO6 when configured as SYNC(O). 90 degrees
ϕ shift_120 GPIOx when configured as phase shifted DC/DC fsw clock output Phase difference between fsw and GPIO6 when configured as SYNC(O). 120 degrees
ϕ shift_180 GPIOx when configured as phase shifted DC/DC fsw clock output Phase difference between fsw and GPIO6 when configured as SYNC(O). 180 degrees
SYNC IN
fSYNC(300kHz) Valid external clock frequency (fSW_internal = 300kHz) 250 353 kHz
fSYNC(400kHz) Valid external clock frequency (fSW_internal = 400kHz) 334 470 kHz
fSYNC(450kHz) Valid external clock frequency (fSW_internal = 450kHz) 376 530 kHz
LSGD
ILSGD_ON NFET driver sourcing current 0 V ≤ VCSN/BUS ≤ 21 V; 0 V ≤ (VLSGD - VCSN/BUS) ≤ 4 V 10 13 16 µA
VLSGD_ON  Sourcing voltage while enabled (VLSGD - VCSN/BUS) 0 V ≤ VCSN/BUS ≤ 21 V; ILSGD ≤ 4 µA. Measure voltage between LSGD and CSN/BUS. 6 8 V
RLSGD_OFF Sinking resistance when disabled VLSGD = VCSN/BUS = 5 V 160 300 kΩ
(1) GPIO9 is normally configured as I2C_IRQ1m (controller): input pin. I2C specification requires use of external pullup resistor. Input thresholds (VIH; VIL) leakage current (II(LEAKAGE))and deglitch timing (tDG) specifications apply when used as I2C_IRQ1m. Internal pullup and pulldown resistors are not used during this mode of operation.
(2) GPIO9 or GPIO1 may be configured as I2C_IRQ2s (target): open-drain output pin. I2C specification requires use of external pullup resistor. Output threshold (VOL) applies. Internal pullup and pulldown resistors are not used during this mode of operation.