Refer to the PDF data sheet for device specific package drawings
The TPS25810A-Q1 device is a USB Type-C downstream-facing port (DFP) controller with an integrated 3-A rated USB power switch. The device monitors the Type-C configuration channel (CC) lines to determine when a USB device is attached. If an upstream-facing port (UFP) device is attached, it applies power to VBUS and communicate the selectable VBUS current-sourcing capability to the UFP via the pass-through CC line. If the UFP is attached using an electronically marked cable, it also applies VCONN power to the cable CC pin. The TPS25810A-Q1 can identify and report when Type-C audio or debug accessories are attached.
PART NUMBER | PACKAGE | BODY SIZE (NOM) |
---|---|---|
TPS25810A-Q1 | WQFN (20) | 3.00 mm x 4.00 mm |
DATE | REVISION | NOTE |
---|---|---|
April 2017 | * | Initial release |
Changes from * Revision () to * Revision
The TPS25810A-Q1 device draws less than 0.7 µA (typical) from the AUX pin when no USB load is connected. Additional system power saving is achievable in the S4 and S5 system power states by using the UFP output to disable the high-power 5-V supply when no UFP is attached. In this mode, the device is capable of running from an auxiliary supply (AUX), which can be a lower-voltage supply (3.3 V), typically powering the system microcontroller in low-power states (S4 and S5).
The TPS25810A-Q1 device integrates a 34-mΩ power switch with a fixed 3.4-A current limit independent of the Type-C current advertisement level. The FAULT output signals when the switch is in an overcurrent or overtemperature condition. The CS output is used for implementing digital cable compensation for load currents greater than 1.95 A. Cable compensation, also known as line drop compensation, is a means of offsetting voltage droop from the USB power supply to the UFP load.
PIN | I/O | DESCRIPTION | ||
---|---|---|---|---|
NAME | NO. | |||
AUDIO | 17 | O | Open-drain logic output that asserts when a Type-C audio accessory is identified on the CC lines | |
AUX | 5 | I | Auxiliary input supply. Connect to an always-alive system rail to use the power-wake feature. Short to IN1 and IN2 if only one supply is used. | |
CC1 | 11 | I/O | Analog input/output that connects to the Type-C receptacle CC1 pin | |
CC2 | 13 | I/O | Analog input/output that connects to the Type-C receptacle CC2 pin. | |
CHG | 7 | I | Charge-logic input to select between standard USB (500 mA for a Type-C receptacle supporting only USB 2.0, and 900 mA for Type-C receptacle supporting USB 3.1) or a Type-C current-sourcing ability. | |
CHG_HI | 8 | I | High-charge logic input to select between 1.5-A and 3-A Type-C current sourcing capability. Valid when CHG is set to Type-C current. | |
CS | 20 | O | Open-drain output enabling digital cable compensation when load current is greater than 1.95 A, nominal. | |
DEBUG | 16 | O | Open-drain logic output that asserts when a Type-C debug accessory is identified on the CC lines | |
EN | 6 | I | Enable logic input. Turns the device on and off | |
FAULT | 1 | O | Fault event indicator. Open-drain logic output that asserts low to indicate a current-limit or thermal-shutdown event due to overtemperature. | |
GND | 12 | — | Power ground | |
IN1 | 2, 3 | I | VBUS input supply. Internal power switch connects IN1 to OUT. | |
IN2 | 4 | I | VCONN input supply. Internal power switch connects IN2 to CC1 or CC2. Short to IN1 if only one supply is used. | |
OUT | 14, 15 | O | Power switch output | |
POL | 18 | O | Polarity open-drain logic output that signals which Type-C CC pin is connected to the CC line. This gives the information needed to multiplex the super-speed lines. Asserted when the CC2 pin is connected to the CC line in the cable. | |
REF | 10 | I | Analog input used to generate the internal current reference. Connect a 1% or better, 100-ppm, 100-kΩ resistor between this pin and REF_RTN. | |
REF_RTN | 9 | I | Precision signal-reference return. Connect to the REF pin via a 100-kΩ, 1% resistor. | |
UFP | 19 | O | Open-drain logic output that asserts when a Type-C UFP is identified on the CC lines. | |
Thermal pad | — | — | Thermal pad on the bottom of the package. The thermal pad is internally connected to GND and is used to heat-sink the device to the circuit board. Connect the thermal pad to the GND plane. |