SLVSE37 April   2017 TPS25810A-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (Continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1 USB Type-C Basic
      2. 8.1.2 Configuration Channel
      3. 8.1.3 Detecting a Connection
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Configuration Channel Pins CC1 and CC2
      2. 8.3.2 Current Capability Advertisement and Overload Protection
      3. 8.3.3 Undervoltage Lockout (UVLO)
        1. 8.3.3.1  Device Power Pins (IN1, IN2, AUX, OUT, and GND)
        2. 8.3.3.2  FAULT Response
        3. 8.3.3.3  Thermal Shutdown
        4. 8.3.3.4  REF
        5. 8.3.3.5  Audio Accessory Detection
        6. 8.3.3.6  Debug Accessory Detection
        7. 8.3.3.7  Plug Polarity Detection
        8. 8.3.3.8  Device Enable Control
        9. 8.3.3.9  Cable Compensation (CS)
        10. 8.3.3.10 Power Wake
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Type-C DFP Port Implementation Without BC 1.2 Support
        1. 9.2.1.1 Design Requirements
          1. 9.2.1.1.1 Input and Output Capacitance
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Type-C DFP Port Implementation With BC 1.2 (DCP Mode) Support
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
      2. 12.2.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RVC|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

DATE REVISION NOTE
April 2017 * Initial release

Changes from * Revision () to * Revision