SLVSEG3E September   2019  – March 2022 TPS25840-Q1 , TPS25842-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (Continued)
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Requirements
    7. 8.7 Switching Characteristics
    8. 8.8 Typical Characteristics
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1  Buck Regulator
      2. 10.3.2  Enable/UVLO
      3. 10.3.3  Switching Frequency and Synchronization (RT/SYNC)
      4. 10.3.4  Spread-Spectrum Operation
      5. 10.3.5  VCC, VCC_UVLO
      6. 10.3.6  Minimum ON-time, Minimum OFF-time
      7. 10.3.7  Internal Compensation
      8. 10.3.8  Bootstrap Voltage (BOOT)
      9. 10.3.9  RSNS, RSET, RILIMIT and RIMON
      10. 10.3.10 Overcurrent and Short Circuit Protection
        1. 10.3.10.1 Current Limit Setting using RILIMIT
        2. 10.3.10.2 Buck Average Current Limit Design Example
        3. 10.3.10.3 External MOSFET Gate Drivers
        4. 10.3.10.4 Cycle-by-Cycle Buck Current Limit
      11. 10.3.11 Overvoltage, IEC and Short-to-Battery Protection
        1. 10.3.11.1 V BUS and V CSN/OUT Overvoltage Protection
        2. 10.3.11.2 DP_IN and DM_IN Protection
      12. 10.3.12 Cable Compensation
        1. 10.3.12.1 Cable Compensation Design Example
      13. 10.3.13 USB Port Control
      14. 10.3.14 FAULT Response
      15. 10.3.15 USB Specification Overview
      16. 10.3.16 Device Power Pins (IN, CSN/OUT, and PGND)
      17. 10.3.17 Thermal Shutdown
    4. 10.4 Device Functional Modes
      1. 10.4.1 Shutdown Mode
      2. 10.4.2 Active Mode
      3. 10.4.3 Device Truth Table (TT)
      4. 10.4.4 USB Port Operating Modes
        1. 10.4.4.1 Standard Downstream Port (SDP) Mode — USB 2.0, USB 3.0, and USB 3.1
        2. 10.4.4.2 Charging Downstream Port (CDP) Mode
        3. 10.4.4.3 Client Mode
      5. 10.4.5 High-bandwidth Data-line Switches
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
        1. 11.2.2.1  Output Voltage
        2. 11.2.2.2  Switching Frequency
        3. 11.2.2.3  Inductor Selection
        4. 11.2.2.4  Output Capacitor Selection
        5. 11.2.2.5  Input Capacitor Selection
        6. 11.2.2.6  Bootstrap Capacitor Selection
        7. 11.2.2.7  VCC Capacitor Selection
        8. 11.2.2.8  Enable and Under Voltage Lockout Set-Point
        9. 11.2.2.9  Current Limit Set-Point
        10. 11.2.2.10 Cable Compensation Set-Point
        11. 11.2.2.11 FAULT Resistor Selection
      3. 11.2.3 Application Curves
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Ground Plane and Thermal Considerations
    3. 13.3 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Documentation Support
      1. 14.1.1 Related Documentation
    2. 14.2 Related Links
    3. 14.3 Receiving Notification of Documentation Updates
    4. 14.4 Support Resources
    5. 14.5 Trademarks
    6. 14.6 Electrostatic Discharge Caution
    7. 14.7 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.2.2.5 Input Capacitor Selection

The TPS2584x-Q1 device requires high frequency input decoupling capacitor(s) and a bulk input capacitor, depending on the application. A high-quality ceramic capacitor type X5R or X7R with sufficient voltage ratings are recommended. To compensate the derating of ceramic capacitors, TI recommends a voltage rating of twice the maximum input voltage. The bulk capacitance selection depends upon a number of factors: long leads from the automotive battery to the IN pin of TPS2584x-Q1, cold or warm engine crank requirements, and so forth. The bulk capacitor is used to dampen voltage spike due to the lead inductance of the cable or the trace. For this design, one 10-μF, 50-V, X7R ceramic capacitors are used. Use a 0.1 μF for high-frequency filtering and place it as close as possible to the device pins. Consider adding additional bulk capacitance for operation through low VIN warm-crank profiles is required by the vehicle OEM.