SLVSFJ9 September   2021 TPS25854-Q1 , TPS25855-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (Continued)
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Requirements
    7. 8.7 Switching Characteristics
    8. 8.8 Typical Characteristics
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1  Power Down or Undervoltage Lockout
      2. 10.3.2  Input Overvoltage Protection (OVP) - Continuously Monitored
      3. 10.3.3  Buck Converter
      4. 10.3.4  FREQ/SYNC
      5. 10.3.5  Bootstrap Voltage (BOOT)
      6. 10.3.6  Minimum ON-time, Minimum OFF-time
      7. 10.3.7  Internal Compensation
      8. 10.3.8  Current Limit and Short Circuit Protection
        1. 10.3.8.1 USB Switch Programmable Current Limit (ILIM)
        2. 10.3.8.2 Cycle-by-Cycle Buck Current Limit
        3. 10.3.8.3 OUT Current Limit
      9. 10.3.9  Cable Compensation
      10. 10.3.10 Thermal Management With Temperature Sensing (TS) and OTSD
      11. 10.3.11 Thermal Shutdown
      12. 10.3.12 FAULT Indication
      13. 10.3.13 USB Specification Overview
      14. 10.3.14 USB Type-C® Basics
        1. 10.3.14.1 Configuration Channel
        2. 10.3.14.2 Detecting a Connection
        3. 10.3.14.3 Plug Polarity Detection
      15. 10.3.15 USB Port Operating Modes
        1. 10.3.15.1 USB Type-C® Mode
        2. 10.3.15.2 Dedicated Charging Port (DCP) Mode
          1. 10.3.15.2.1 DCP BC1.2 and YD/T 1591-2009
          2. 10.3.15.2.2 DCP Divider-Charging Scheme
          3. 10.3.15.2.3 DCP 1.2-V Charging Scheme
        3. 10.3.15.3 DCP Auto Mode
    4. 10.4 Device Functional Modes
      1. 10.4.1 Shutdown Mode
      2. 10.4.2 Active Mode
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Applications
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
        1. 11.2.2.1 Output Voltage Setting
        2. 11.2.2.2 Switching Frequency
        3. 11.2.2.3 Inductor Selection
        4. 11.2.2.4 Output Capacitor Selection
        5. 11.2.2.5 Input Capacitor Selection
        6. 11.2.2.6 Bootstrap Capacitor Selection
        7. 11.2.2.7 Undervoltage Lockout Set-Point
        8. 11.2.2.8 Cable Compensation Set-Point
        9. 11.2.2.9 FAULT, POL, and THERM_WARN Resistor Selection
      3. 11.2.3 Application Curves
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
    3. 13.3 Ground Plane and Thermal Considerations
  14. 14Device and Documentation Support
    1. 14.1 Receiving Notification of Documentation Updates
    2. 14.2 Support Resources
    3. 14.3 Trademarks
    4. 14.4 Electrostatic Discharge Caution
    5. 14.5 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.3.11 Thermal Shutdown

The device has an internal over temperature shutdown threshold, TSD to protect the device from damage and overall safety of the system. When device temperature exceeds TSD, the device is turned off when thermal shutdown activates. Once the die temperature falls below 154°C (typical), the device re initiates the power up sequence controlled by the internal soft-start circuitry.