SLVSFJ9 September   2021 TPS25854-Q1 , TPS25855-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (Continued)
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Requirements
    7. 8.7 Switching Characteristics
    8. 8.8 Typical Characteristics
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1  Power Down or Undervoltage Lockout
      2. 10.3.2  Input Overvoltage Protection (OVP) - Continuously Monitored
      3. 10.3.3  Buck Converter
      4. 10.3.4  FREQ/SYNC
      5. 10.3.5  Bootstrap Voltage (BOOT)
      6. 10.3.6  Minimum ON-time, Minimum OFF-time
      7. 10.3.7  Internal Compensation
      8. 10.3.8  Current Limit and Short Circuit Protection
        1. 10.3.8.1 USB Switch Programmable Current Limit (ILIM)
        2. 10.3.8.2 Cycle-by-Cycle Buck Current Limit
        3. 10.3.8.3 OUT Current Limit
      9. 10.3.9  Cable Compensation
      10. 10.3.10 Thermal Management With Temperature Sensing (TS) and OTSD
      11. 10.3.11 Thermal Shutdown
      12. 10.3.12 FAULT Indication
      13. 10.3.13 USB Specification Overview
      14. 10.3.14 USB Type-C® Basics
        1. 10.3.14.1 Configuration Channel
        2. 10.3.14.2 Detecting a Connection
        3. 10.3.14.3 Plug Polarity Detection
      15. 10.3.15 USB Port Operating Modes
        1. 10.3.15.1 USB Type-C® Mode
        2. 10.3.15.2 Dedicated Charging Port (DCP) Mode
          1. 10.3.15.2.1 DCP BC1.2 and YD/T 1591-2009
          2. 10.3.15.2.2 DCP Divider-Charging Scheme
          3. 10.3.15.2.3 DCP 1.2-V Charging Scheme
        3. 10.3.15.3 DCP Auto Mode
    4. 10.4 Device Functional Modes
      1. 10.4.1 Shutdown Mode
      2. 10.4.2 Active Mode
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Applications
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
        1. 11.2.2.1 Output Voltage Setting
        2. 11.2.2.2 Switching Frequency
        3. 11.2.2.3 Inductor Selection
        4. 11.2.2.4 Output Capacitor Selection
        5. 11.2.2.5 Input Capacitor Selection
        6. 11.2.2.6 Bootstrap Capacitor Selection
        7. 11.2.2.7 Undervoltage Lockout Set-Point
        8. 11.2.2.8 Cable Compensation Set-Point
        9. 11.2.2.9 FAULT, POL, and THERM_WARN Resistor Selection
      3. 11.2.3 Application Curves
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
    3. 13.3 Ground Plane and Thermal Considerations
  14. 14Device and Documentation Support
    1. 14.1 Receiving Notification of Documentation Updates
    2. 14.2 Support Resources
    3. 14.3 Trademarks
    4. 14.4 Electrostatic Discharge Caution
    5. 14.5 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.1 Absolute Maximum Ratings

Over the recommended operating junction temperature range of -40°C to +150°C and AGND = PGND (unless otherwise noted)(1)
PARAMETER MIN MAX UNIT
Input voltage IN to PGND –0.3 40(2) V
IN to SW –0.3 35
BIAS, SENSE to PGND –0.3 6
EN to AGND –0.3 11
FREQ/SYNC to AGND –0.3 6
ILIM, IMON to AGND –0.3 6
AGND to PGND –0.3 0.3 V
Output voltage SW to PGND –0.3 35 V
SW to PGND (less than 10 ns transients) –3.5 35
BOOT to SW –0.3 6
BUS, OUT to PGND –0.3 6
Voltage range CC1, CC2 to AGND –0.3 6 V
DP, DM to AGND –0.3 6
TS to AGND –0.3 6
FAULT, POL, THERM_WARN to AGND –0.3 6 V
Pin positive sink current, ISNK CC1, CC2 (while applying VCONN) 1 A
I/O current DP to DM in BC1.2 DCP Mode –35 35 mA
TJ Junction temperature -40 150 °C
Tstg Storage temperature –65 150 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) VIN rising slew rate below 20 V/ms if in 0-V to 40-V transient, room temperature, maximum 500 uF cap at SENSE.