SLVSF62B November 2020 – September 2021 TPS25858-Q1 , TPS25859-Q1
PRODUCTION DATA
THERMAL METRIC(1) (2) | TPS2585x-Q1 | UNIT | |
---|---|---|---|
RPQ (VQFN) | |||
25 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 37.7 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 17.2 | °C/W |
RθJB | Junction-to-board thermal resistance | 8.8 | °C/W |
ΨJT | Junction-to-top characterization parameter | 0.3 | °C/W |
ΨJB | Junction-to-board characterization parameter | 8.8 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 20.3 | °C/W |