SLVSFP0 August   2021 TPS25860-Q1 , TPS25862-Q1

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (continued)
  6. Device Comparison Table
  7. Pin Configuration and Functions
  8. Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Requirements
    7. 8.7 Switching Characteristics
    8. 8.8 Typical Characteristics
  9. Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1  Power-Down or Undervoltage Lockout
      2. 10.3.2  Input Overvoltage Protection (OVP) - Continuously Monitored
      3. 10.3.3  Buck Converter
      4. 10.3.4  FREQ/SYNC
      5. 10.3.5  Bootstrap Voltage (BOOT)
      6. 10.3.6  Minimum ON-Time, Minimum OFF-Time
      7. 10.3.7  Internal Compensation
      8. 10.3.8  Selectable Output Voltage (VSET)
      9. 10.3.9  Current Limit and Short Circuit Protection
        1. 10.3.9.1 USB Switch Programmable Current Limit (ILIM)
        2. 10.3.9.2 Interlocking for Two-Level USB Switch Current Limit
        3. 10.3.9.3 Cycle-by-Cycle Buck Current Limit
        4. 10.3.9.4 OUT Current Limit
      10. 10.3.10 Cable Compensation
      11. 10.3.11 Thermal Management with Temperature Sensing (TS) and OTSD
      12. 10.3.12 Thermal Shutdown
      13. 10.3.13 USB Enable On/Off Control (TPS25862-Q1)
      14. 10.3.14 FAULT Indication
      15. 10.3.15 USB Specification Overview
      16. 10.3.16 USB Type-C® Basics
        1. 10.3.16.1 Configuration Channel
        2. 10.3.16.2 Detecting a Connection
      17. 10.3.17 USB Port Operating Modes
        1. 10.3.17.1 USB Type-C® Mode
        2. 10.3.17.2 Dedicated Charging Port (DCP) Mode (TPS25860-Q1 Only)
          1. 10.3.17.2.1 DCP BC1.2 and YD/T 1591-2009
          2. 10.3.17.2.2 DCP Divider-Charging Scheme
          3. 10.3.17.2.3 DCP 1.2-V Charging Scheme
        3. 10.3.17.3 DCP Auto Mode (TPS25860-Q1)
    4. 10.4 Device Functional Modes
      1. 10.4.1 Shutdown Mode
      2. 10.4.2 Active Mode
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Applications
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
        1. 11.2.2.1 Output Voltage Setting
        2. 11.2.2.2 Switching Frequency
        3. 11.2.2.3 Inductor Selection
        4. 11.2.2.4 Output Capacitor Selection
        5. 11.2.2.5 Input Capacitor Selection
        6. 11.2.2.6 Bootstrap Capacitor Selection
        7. 11.2.2.7 Undervoltage Lockout Set-Point
        8. 11.2.2.8 Cable Compensation Set-Point
        9. 11.2.2.9 FAULT Resistor Selection
      3. 11.2.3 Application Curves
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
    3. 13.3 Ground Plane and Thermal Considerations
  14. 14Device and Documentation Support
    1. 14.1 Receiving Notification of Documentation Updates
    2. 14.2 Support Resources
    3. 14.3 Trademarks
    4. 14.4 Electrostatic Discharge Caution
    5. 14.5 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Absolute Maximum Ratings

Over the recommended operating junction temperature range of -40°C to +150°C and AGND = PGND (unless otherwise noted)(1)
PARAMETERMINMAXUNIT
Input voltageIN to PGND–0.340(2)V
IN to SW–0.335
SENSE to PGND–0.36
EN to AGND–0.311
FREQ/SYNC to AGND–0.36
PA_EN, PB_EN to AGND–0.36
VSET, ILIM to AGND-0.36
AGND to PGND–0.30.3
Input voltagePA_FAULT, PB_FAULTFAULT to AGND–0.36V
Output voltageSW to PGND–0.326V
SW to PGND (less than 10 ns transients)–3.535
BOOT to SW–0.36
PA_BUS, PB_BUS to PGND–0.36
Voltage rangeCC1, CC2, CFG to AGND–0.36V
DP, DM to AGND–0.36
PA_FAULT, PB_FAULT to AGND–0.36
TS to AGND–0.36
Pin positive sink current, ISNKCC1, CC2 (while applying VCONN)1A
I/O currentDP to DM in BC1.2 DCP Mode–3535mA
TJJunction temperature–40150°C
TstgStorage temperature–65150°C
Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
VIN rising slew rate below 20 V/ms if in 0 V to 36 V or above transient.