SLVSCU9B August   2015  – September 2016

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 GND
      2. 8.3.2 VIN
      3. 8.3.3 dV/dT
      4. 8.3.4 BFET
      5. 8.3.5 EN/UVLO
      6. 8.3.6 ILIM
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Simple 3.7-A eFuse Protection for Set Top Boxes
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Step by Step Design Procedure
          2. 9.2.1.2.2 Programming the Current-Limit Threshold: RILIM Selection
          3. 9.2.1.2.3 Undervoltage Lockout Set Point
          4. 9.2.1.2.4 Setting Output Voltage Ramp Time (TdVdT)
            1. 9.2.1.2.4.1 Case 1: Start-Up without Load: Only Output Capacitance COUT Draws Current During Start-Up
            2. 9.2.1.2.4.2 Case 2: Start-Up with Load: Output Capacitance COUT and Load Draws Current During Start-Up
          5. 9.2.1.2.5 Support Component Selection—CVIN
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Inrush and Reverse Current Protection for Hold-Up Capacitor Application (for example, SSD)
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Programming the Current-Limit Threshold: RILIM Selection
          2. 9.2.2.2.2 Undervoltage Lockout Set Point
          3. 9.2.2.2.3 Setting Output Voltage Ramp Time (TdVdT)
        3. 9.2.2.3 Application Curves
      3. 9.2.3 Controlled Power Down using TPS25924x
  10. 10Power Supply Recommendations
    1. 10.1 Transient Protection
    2. 10.2 Output Short-Circuit Measurements
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Community Resources
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from A Revision (August 2015) to B Revision

Changes from * Revision (August 2015) to A Revision

  • Changed from Product Preview to Production Data Go