SLVSCQ3B August   2015  – June 2016

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 GND
      2. 8.3.2 VIN
      3. 8.3.3 dV/dT
      4. 8.3.4 EN/UVLO
      5. 8.3.5 ILIM
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Programming the Current-Limit Threshold: RILIM Selection
        2. 9.2.2.2 Undervoltage Lockout Set Point
        3. 9.2.2.3 Setting Output Voltage Ramp Time (TdVdT)
          1. 9.2.2.3.1 Case 1: Start-Up without Load: Only Output Capacitance COUT Draws Current During Start-Up
          2. 9.2.2.3.2 Case 2: Start-Up with Load: Output Capacitance COUT and Load Draws Current During Start-Up
        4. 9.2.2.4 Support Component Selection—CVIN
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Transient Protection
    2. 10.2 Output Short-Circuit Measurements
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Community Resources
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings

over operating temperature range (unless otherwise noted) (1) (2)
MIN MAX UNIT
Supply voltage(2) VIN –0.3 20 V
VIN (transient < 1 ms) 22
Output voltage OUT –0.3 VIN + 0.3 V
OUT (transient < 1 µs) –1.2
Voltage ILIM –0.3 7 V
Continuous output current 6.25(3) A
Voltage EN/UVLO –0.3 7 V
Voltage dV/dT –0.3 7 V
Storage temperature Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential voltages, are with respect to network ground terminal.
(3) Device supports high peak current during short circuit conditions until current is internally limited.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN TYP MAX UNIT
Input voltage VIN (TPS25926x) 4.5 12 13.8 V
VIN (TPS25925x) 4.5 5 5.5
dV/dT, EN/UVLO 0 6
ILIM 0 3
Continuous output current IOUT 0 5 A
Resistance ILIM 10 100 162 kΩ
External capacitance OUT 0.1 1 1000 µF
dV/dT 1 1000 nF
Operating junction temperature TJ –40 25 125 °C
Operating ambient temperature TA –40 25 85 °C

7.4 Thermal Information(1)

over operating free-air temperature range (unless otherwise noted)
THERMAL METRIC TPS25925x/6x UNIT
DRC (VSON)
10 PINS
RθJA Junction-to-ambient thermal resistance 45.9 °C/W
RθJCtop Junction-to-case (top) thermal resistance 53 °C/W
RθJB Junction-to-board thermal resistance 21.2 °C/W
ψJT Junction-to-top characterization parameter 1.2 °C/W
ψJB Junction-to-board characterization parameter 21.4 °C/W
RθJCbot Junction-to-case (bottom) thermal resistance 5.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

–40°C ≤ TJ ≤ +125°C, VIN = 12 V for TPS25926x, VIN = 5 V for TPS25925x, VEN /UVLO = 2 V, RILIM = 100 kΩ, CdVdT = OPEN. All voltages referenced to GND (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIN (INPUT SUPPLY)
VUVR UVLO threshold, rising 4.15 4.3 4.45 V
VUVhyst UVLO hysteresis(1) 5%
IQON Supply current Enabled: EN/UVLO = 2 V, TPS25926x 0.3 0.47 0.55 mA
Enabled: EN/UVLO = 2 V, TPS25925x 0.35 0.42 0.6 mA
IQOFF EN/UVLO = 0 V 0.13 0.225 mA
VOVC Over-voltage clamp VIN > 16.5 V, IOUT = 10 mA, TPS25926x 13.8 15 16.5 V
VIN > 6.75 V, IOUT = 10 mA,
–40℃ ≤ TJ ≤ +85℃, TPS25925x		 5.5 6.1 6.75
VIN > 6.75 V, IOUT = 10 mA,
–40℃ ≤ TJ ≤ +125℃, TPS25925x		 5.25 6.1 6.75
EN/UVLO (ENABLE/UVLO INPUT)
VENR EN threshold voltage, rising 1.37 1.4 1.44 V
VENF EN threshold voltage, falling 1.32 1.35 1.39 V
IEN EN input leakage current 0 V ≤ VEN ≤ 5 V –100 0 100 nA
dV/dT (OUTPUT RAMP CONTROL)
IdVdT dV/dT charging current(1) VdVdT = 0 V 220 nA
RdVdT_disch dV/dT discharging resistance EN/UVLO = 0 V, IdVdT = 10 mA sinking 50 73 100 Ω
VdVdTmax dV/dT maximum capacitor voltage(1) 5.5 V
GAINdVdT dV/dT to OUT gain(1) ΔVdVdT 4.85 V/V
ILIM (CURRENT LIMIT PROGRAMMING)
IILIM ILIM bias current(1) 10 µA
IOL Overload current limit(2) RILIM = 45.3 kΩ, VVIN-OUT = 1 V 1.75 2.1 2.45 A
RILIM = 100 kΩ, VVIN-OUT = 1 V 3.4 3.75 4.05
RILIM = 150 kΩ, VVIN-OUT = 1 V 4.5 5.1 5.7
IOL-R-Short RILIM = 0 Ω, shorted resistor current limit (single point failure test: UL60950)(1) 0.84 A
IOL-R-Open RILIM = OPEN, open resistor current limit (single point failure test: UL60950)(1) 0.73 A
ISCL Short-circuit current limit(2) RILIM = 45.3 kΩ, VVIN-OUT = 5 V, TPS25925x 1.72 2.05 2.42 A
RILIM = 45.3 kΩ, VVIN-OUT = 12 V, TPS25926x 1.62 1.98 2.37
RILIM = 100 kΩ, VVIN-OUT = 5 V, TPS25925x 3.1 3.56 4
RILIM = 100 kΩ, VVIN-OUT = 12 V, TPS25926x 2.9 3.32 3.85
RILIM = 150 kΩ, VVIN-OUT = 5 V, TPS25925x 4.22 4.95 5.69
RILIM = 150 kΩ, VVIN-OUT = 12 V, TPS25926x 3.7 4.5 5.5
RATIOFASTRIP Fast-trip comparator level w.r.t. overload current limit(1) IFASTRIP : IOL 160%
VOpenILIM ILIM open resistor detect threshold(1) VILIM Rising, RILIM = OPEN 3.1 V
OUT (PASS FET OUTPUT)
TON Turnon delay(1) EN/UVLO → H to IVIN = 100 mA, 1-A resistive load at OUT 220 µs
RDS(on) FET ON resistance TJ = 25°C 21 30 39 mΩ
TJ = 125°C 40 50
IOUT-OFF-LKG OUT bias current in off state VEN/UVLO = 0 V, VOUT = 0 V (sourcing) –5 0 1.2 µA
IOUT-OFF-SINK VEN/UVLO = 0V, VOUT = 300 mV (sinking) 10 15 20
THERMAL SHUT DOWN (TSD)
TSHDN TSD threshold, rising(1) 150 °C
TSHDNhyst TSD hysteresis(1) 10 °C
Thermal fault: latched or autoretry TPS259250, TPS259260 Latched
TPS259251, TPS259261 Auto-retry
(1) These parameters are provided for reference only and do not constitute part of TI's published device specifications for purposes of TI's product warranty.
(2) Pulsed testing techniques used during this test maintain junction temperature approximately equal to ambient temperature.

7.6 Timing Requirements

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tOFFdly Turnoff delay(1) EN↓ 0.4 µs
dV/dT (OUTPUT RAMP CONTROL)
tdVdT Output ramp time TPS25926x, EN/UVLO → H to OUT = 11.7 V, CdVdT = 0 0.7 1 1.3 ms
TPS25925x, EN/UVLO → H to OUT = 4.9 V, CdVdT = 0 0.28 0.4 0.52
TPS25926x, EN/UVLO → H to OUT = 11.7 V,
CdVdT = 1 nF(1) 		12
TPS25925x, EN/UVLO → H to OUT = 4.9 V,
CdVdT = 1 nF(1) 		5
ILIM (CURRENT LIMIT PROGRAMMING)
tFastOffDly Fast-trip comparator delay(1) IOUT > IFASTRIP to IOUT= 0 (Switch off) 300 ns
THERMAL SHUTDOWN (TSD)
tTSDdly Retry delay after TSD recovery, TJ < [TSHDN – 10oC](1) At VIN = 5 V, TPS259251 and TPS259261 110 ms
At VIN = 12 V, TPS259251 and TPS259261 145
(1) These parameters are provided for reference only and do not constitute part of TI's published device specifications for purposes of TI's product warranty.

7.7 Typical Characteristics

TJ = 25°C, VVIN = 12 V for TPS25926x, VVIN = 5 V for TPS25925x, VEN/UVLO = 2 V, RILIM = 100 kΩ, CVIN = 0.1 µF, COUT = 1 µF, CdVdT = OPEN (unless stated otherwise)
TPS259250 TPS259251 TPS259260 TPS259261 C001_SLVSC11.png
Figure 1. Input UVLO vs Temperature
TPS259250 TPS259251 TPS259260 TPS259261 C003_SLVSC11.png
TPS25926x
Figure 3. IVIN-ON vs VIN
TPS259250 TPS259251 TPS259260 TPS259261 C005_SLVSC11.png
TPS25926x
Figure 5. VOVC vs Temperature Across IOUT
TPS259250 TPS259251 TPS259260 TPS259261 D025_SLVSCQ3.gif
Figure 7. Accuracy vs Overload Current Limit
TPS259250 TPS259251 TPS259260 TPS259261 C013_SLVSC11.png
TPS25926x
Figure 9. TdVdT vs CdVdT
TPS259250 TPS259251 TPS259260 TPS259261 C015_revB_SLVSC11.gif
Figure 11. VEN-VIH, VEN-VIL vs Temperature
TPS259250 TPS259251 TPS259260 TPS259261 D019_SLVSCQ3.gif
RILIM = 0Ω
Figure 13. IOL-R-Short vs Temperature
TPS259250 TPS259251 TPS259260 TPS259261 D045_SLVSCQ3.gif
Figure 15. Retry Delay vs VVIN
TPS259250 TPS259251 TPS259260 TPS259261 C027_SLVSC11_lvscq3.gif
RILIM = 150 kΩ
Figure 17. IVOUT vs VVIN-OUT
TPS259250 TPS259251 TPS259260 TPS259261 C030_2_SLVSCQ3.gif
RILIM = 150 kΩ
Figure 19. IOL, ISC vs Temperature
TPS259250 TPS259251 TPS259260 TPS259261 C032_SLVSCQ3.png
RILIM = 45.3 kΩ
Figure 21. IOL, ISC vs Temperature
TPS259250 TPS259251 TPS259260 TPS259261 fig17_revB2_lvsc11.gif
TPS25926x, CdVdT = OPEN, COUT = 4.7 µF
Figure 23. Transient: Output Ramp
TPS259250 TPS259251 TPS259260 TPS259261 fig07_revB_SLVSC11.gif
TPS25926x
Figure 25. Transient: Over-Voltage Clamp
TPS259250 TPS259251 TPS259260 TPS259261 Fig_23_slvscq3.png
TPS259251/61, VVIN = 5 V
Figure 27. Transient: Thermal Fault Auto-Retry
TPS259250 TPS259251 TPS259260 TPS259261 FP_Fig_21_29_slvscq3.png
TPS25925x/6x, VVIN = 5 V, RILIM = 150 kΩ
Figure 29. Transient: Output Short Circuit
TPS259250 TPS259251 TPS259260 TPS259261 Transient_Wake_up_slvscq3.png
TPS259251/61 , VVIN = 5 V
Figure 31. Transient: Wake Up to Short Circuit
TPS259250 TPS259251 TPS259260 TPS259261 FP_24_35_slvscu9.png
TPS25926x , VVIN = 12 V, RILIM = 150 kΩ
Figure 33. Transient: Output Short Circuit
TPS259250 TPS259251 TPS259260 TPS259261 61_Wakeup_slvscq3.png
TPS25926x, VVIN = 12 V
Figure 35. Transient: Wake Up to Short Circuit
TPS259250 TPS259251 TPS259260 TPS259261 Trans_Therm_slvscq3.png
TPS25926x, VVIN = 12 V
Figure 37. Transient: Thermal Fault Auto-Retry
TPS259250 TPS259251 TPS259260 TPS259261 C002_SLVSC11.png
Figure 2. IQ-OFF vs VIN
TPS259250 TPS259251 TPS259260 TPS259261 C004_SLVSC11.png
TPS25925x
Figure 4. IVIN-ON vs VIN
TPS259250 TPS259251 TPS259260 TPS259261 C006B_SLVSCQ3.gif
TPS25925x
Figure 6. VOVC vs Temperature
TPS259250 TPS259251 TPS259260 TPS259261 C046_SLVSC11.png
Figure 8. RILM Resistor vs Overload Current Limit
TPS259250 TPS259251 TPS259260 TPS259261 C014_SLVSC11.png
TPS25925x
Figure 10. TdVdT vs CdVdT
TPS259250 TPS259251 TPS259260 TPS259261 C001_SLVSCQ3.png
Figure 12. RDSON vs Temperature
TPS259250 TPS259251 TPS259260 TPS259261 D020_SLVSCQ3.gif
RILIM = OPEN
Figure 14. IOL-R-Open vs Temperature
TPS259250 TPS259251 TPS259260 TPS259261 C028_SLVSC11_lvscq3.gif
RILIM = 100 kΩ
Figure 16. IVOUT vs VVIN-OUT
TPS259250 TPS259251 TPS259260 TPS259261 C029_SLVSC11_lvscq3.gif
RILIM = 45.3 kΩ
Figure 18. IVOUT vs VVIN-OUT
TPS259250 TPS259251 TPS259260 TPS259261 C031_SLVSCQ3.png
RILIM = 100 kΩ
Figure 20. IOL, ISC vs Temperature
TPS259250 TPS259251 TPS259260 TPS259261 D031_SLVSCQ3.gif
Figure 22. Thermal Shutdown Time vs Power Dissipation
TPS259250 TPS259251 TPS259260 TPS259261 fig19_revB2_lvsc11.gif
TPS25925x, CdVdT = OPEN, COUT= 4.7 µF
Figure 24. Transient: Output Ramp
TPS259250 TPS259251 TPS259260 TPS259261 fig08_revB_SLVSC11.gif
TPS25925x
Figure 26. Transient: Over-Voltage Clamp
TPS259250 TPS259251 TPS259260 TPS259261 fig42_revB2_lvsc11.gif
TPS259250/60 , VVIN = 5 V
Figure 28. Transient: Thermal Fault Latched
TPS259250 TPS259251 TPS259260 TPS259261 Fig_22_slvscq3.png
TPS25925x/6x, VVIN = 5 V, RILIM = 150 kΩ
Figure 30. Short Circuit (Zoom): Fast-Trip Comparator
TPS259250 TPS259251 TPS259260 TPS259261 Transient_Recov_slvscq3.png
TPS259251/61 , VVIN = 5 V, CdVdT = 1nF
Figure 32. Transient: Recovery from Short Circuit
TPS259250 TPS259251 TPS259260 TPS259261 Fig_25_slvscu9.png
TPS25926x, VVIN = 12 V, RILIM = 150 kΩ
Figure 34. Short Circuit (Zoom): Fast-Trip Comparator
TPS259250 TPS259251 TPS259260 TPS259261 61_Trans_Recov_slvscq3.png
TPS25926x, VVIN = 12 V, CdVdT = 1 nF
Figure 36. Transient: Recovery from Short Circuit
TPS259250 TPS259251 TPS259260 TPS259261 Fig_30_slvscq3.png
ILOAD stepped From 65% to 125%, back to 65%
Figure 38. Transient: Overload Current Limit