SLVSDJ0E May   2016  – January 2021 TPS25940-Q1

PRODMIX  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Parametric Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Enable and Adjusting Undervoltage Lockout
      2. 9.3.2 Overvoltage Protection (OVP)
      3. 9.3.3 Hot Plug-In and In-Rush Current Control
      4. 9.3.4 Overload and Short Circuit Protection
        1. 9.3.4.1 Overload Protection
        2. 9.3.4.2 Short Circuit Protection
        3. 9.3.4.3 Start-Up with Short on Output
        4. 9.3.4.4 Constant Current Limit Behavior During Overcurrent Faults
      5. 9.3.5 FAULT Response
      6. 9.3.6 Current Monitoring
      7. 9.3.7 Power Good Comparator
      8. 9.3.8 IN, OUT and GND Pins
      9. 9.3.9 Thermal Shutdown
    4. 9.4 Device Functional Modes
      1. 9.4.1 DevSleep Mode
      2. 9.4.2 Shutdown Control
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Step by Step Design Procedure
        2. 10.2.2.2 Programming the Current-Limit Threshold: R(ILIM) Selection
        3. 10.2.2.3 Undervoltage Lockout and Overvoltage Set Point
        4. 10.2.2.4 Programming Current Monitoring Resistor—RIMON
        5. 10.2.2.5 Setting Output Voltage Ramp Time (tdVdT)
          1. 10.2.2.5.1 Case1: Start-Up Without Load: Only Output Capacitance C(OUT) Draws Current During Start-Up
          2. 10.2.2.5.2 Case 2: Start-Up With Load: Output Capacitance C(OUT) and Load Draws Current During Start-Up
        6. 10.2.2.6 Programing the Power Good Set Point
        7. 10.2.2.7 Support Component Selections—R6, R7 and CIN
      3. 10.2.3 Application Curves
      4. 10.2.4 System Examples
        1. 10.2.4.1 VBUS Short-to-Battery, Short-to-Ground Protection of USB Port in Automotive Systems
        2. 10.2.4.2 Power Failure Protection for Holdup Power
        3. 10.2.4.3 Overload Detection Using TPS25940xx-Q1
  11. 11Power Supply Recommendations
    1. 11.1 Transient Protection
    2. 11.2 Output Short-Circuit Measurements
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Support Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MINMAXUNIT
Input voltageIN, OUT, PGTH, PGOOD, EN/UVLO, OVP, DEVSLP, FLT–0.320V
IN, OUT (10 ms transient)22
dVdT, ILIM–0.33.6
IMON–0.37
Sink currentPGOOD, FLT, dVdT10mA
Maximum continuous switch current, TA = 85°C(2)IMAX4.78A
Source currentdVdT, ILIM, IMONInternally Limited
Continuous power dissipationSee the Thermal Information table
Maximum junction temperatureTJ–40150°C
Storage temperatureTstg–65150°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Assumes 15 K power-on-hours at 100% duty cycle. This information is provided solely for your convenience and does not extend or modify the warranty provided under TI's standard terms and conditions for TI's semiconductor products.