SLVSCE9D June   2014  – October  2017 TPS25942A , TPS25942L , TPS25944A , TPS25944L

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Enable and Adjusting Undervoltage Lockout
      2. 9.3.2  Overvoltage Protection (OVP)
      3. 9.3.3  Hot Plug-In and In-Rush Current Control
      4. 9.3.4  Overload and Short Circuit Protection
        1. 9.3.4.1 Overload Protection
        2. 9.3.4.2 Short Circuit Protection
        3. 9.3.4.3 Start-Up With Short on Output
        4. 9.3.4.4 Constant Current Limit Behavior During Overcurrent Faults
      5. 9.3.5  Reverse Current Protection
      6. 9.3.6  FAULT Response
      7. 9.3.7  Current Monitoring
      8. 9.3.8  Power Good Comparator
      9. 9.3.9  IN, OUT and GND Pins
      10. 9.3.10 Thermal Shutdown
    4. 9.4 Device Functional Modes
      1. 9.4.1 Diode Mode
      2. 9.4.2 Shutdown Control
      3. 9.4.3 Operational Differences Between the TPS25942 and TPS25944
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Step by Step Design Procedure
        2. 10.2.2.2 Programming the Current-Limit Threshold: R(ILIM) Selection
        3. 10.2.2.3 Undervoltage Lockout and Overvoltage Set Point
        4. 10.2.2.4 Programming Current Monitoring Resistor—RIMON
        5. 10.2.2.5 Setting Output Voltage Ramp Time (tdVdT)
          1. 10.2.2.5.1 Case1: Start-Up Without Load: Only Output Capacitance C(OUT) Draws Current During Start-Up
          2. 10.2.2.5.2 Case 2: Start-Up With Load: Output Capacitance C(OUT) and Load Draws Current During Start-Up
        6. 10.2.2.6 Programing the Power Good Set Point
        7. 10.2.2.7 Support Component Selections—R6, R7 and CIN
      3. 10.2.3 Application Curves
    3. 10.3 System Examples
      1. 10.3.1 Active ORing (Auto-Power Multiplexer) Operation
        1. 10.3.1.1 N+1 Power Supply Operation
        2. 10.3.1.2 Priority Power MUX Operation
        3. 10.3.1.3 Priority MUXing With Almost Equal Rails (VIN1 ~ VIN2)
        4. 10.3.1.4 Reverse Polarity Protection
  11. 11Power Supply Recommendations
    1. 11.1 Transient Protection
    2. 11.2 Output Short-Circuit Measurements
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Related Links
    4. 13.4 Receiving Notification of Documentation Updates
    5. 13.5 Community Resources
    6. 13.6 Trademarks
    7. 13.7 Electrostatic Discharge Caution
    8. 13.8 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.1 Transient Protection

In case of short circuit and over load current limit, when the device interrupts current flow, input inductance generates a positive voltage spike on the input and output inductance generates a negative voltage spike on the output. The peak amplitude of voltage spikes (transients) is dependent on value of inductance in series to the input or output of the device. Such transients can exceed the Absolute Maximum Ratings of the device if steps are not taken to address the issue.

Typical methods for addressing transients include

  • Minimizing lead length and inductance into and out of the device
  • Using large PCB GND plane
  • Schottky diode across the output to absorb negative spikes
  • A low value ceramic capacitor (C(IN) = 0.001 µF to 0.1 µF) to absorb the energy and dampen the transients. The approximate value of input capacitance can be estimated with Equation 37.

Equation 37. TPS25942A TPS25942L TPS25944A TPS25944L eq_43_slvsce9.gif

where

  • V(IN) is the nominal supply voltage
  • I(LOAD) is the load current,
  • L(IN) equals the effective inductance seen looking into the source
  • C(IN) is the capacitance present at the input

Some applications may require the addition of a Transient Voltage Suppressor (TVS) to prevent transients from exceeding the Absolute Maximum Ratings of the device.

The circuit implementation with optional protection components (a ceramic capacitor, TVS and schottky diode) is shown in Figure 87.

TPS25942A TPS25942L TPS25944A TPS25944L Schematics_Transient_Protection_Of_Device_slvsce9.gif
A. Optional components needed for suppression of transients
Figure 87. Circuit Implementation With Optional Protection Components