SLVSGG5C november   2021  – april 2023 TPS2597

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Undervoltage Lockout (UVLO and UVP)
      2. 8.3.2 Overvoltage Lockout (OVLO)
      3. 8.3.3 Overvoltage Clamp (OVC)
      4. 8.3.4 Inrush Current, Overcurrent, and Short Circuit Protection
        1. 8.3.4.1 Slew Rate (dVdt) and Inrush Current Control
        2. 8.3.4.2 Circuit-Breaker
        3. 8.3.4.3 Active Current Limiting
        4. 8.3.4.4 Short-Circuit Protection
      5. 8.3.5 Analog Load Current Monitor
      6. 8.3.6 Overtemperature Protection (OTP)
      7. 8.3.7 Fault Response and Indication (FLT)
      8. 8.3.8 Power-Good Indication (PG)
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Single Device, Self-Controlled
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Device Selection
        2. 9.2.2.2 Setting Undervoltage and Overvoltage Thresholds
        3. 9.2.2.3 Setting Output Voltage Rise Time (tR)
        4. 9.2.2.4 Setting Power-Good Assertion Threshold
        5. 9.2.2.5 Setting Overcurrent Threshold (ILIM)
        6. 9.2.2.6 Setting Overcurrent Blanking Interval (tITIMER)
      3. 9.2.3 Application Curves
    3. 9.3 Parallel Operation
    4. 9.4 Power Supply Recommendations
      1. 9.4.1 Transient Protection
      2. 9.4.2 Output Short-Circuit Measurements
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.6 Overtemperature Protection (OTP)

The device monitors the internal die temperature (TJ) at all times and shuts down the part as soon as the temperature exceeds a safe operating level (TSD), thereby protecting the device from damage. The device does not turn back on until the junction cools down sufficiently, that is the die temperature falls below (TSD – TSDHYS).

When the TPS2597xL (latch-off variant) detects thermal overload, it shuts down and remains latched-off until the device is power cycled or re-enabled. When the TPS2597xA (auto-retry variant) detects thermal overload, it remains off until it has cooled down by TSDHYS. Thereafter, the device remains off for an additional delay of tRST after which it automatically retries to turn on if it is still enabled.

Table 8-2 Thermal Shutdown
DEVICEENTER TSDEXIT TSD
TPS2597xL (Latch-Off)TJ ≥ TSDTJ < TSD – TSDHYS

VIN cycled to 0 V and then above VUVP(R) OR EN/UVLO toggled below VSD(F)

TPS2597xA (Auto-Retry)TJ ≥ TSDTJ < TSD – TSDHYS

VIN cycled to 0 V and then above VUVP(R) or EN/UVLO toggled below VSD(F) or tRST timer expired