SLVSGX1A July   2023  – October 2023 TPS25984

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Description (continued)
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Logic Interface
    7. 7.7 Timing Requirements
    8. 7.8 Switching Characteristics
    9. 7.9 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Undervoltage Protection
      2. 8.3.2  Insertion Delay
      3. 8.3.3  Overvoltage Protection
      4. 8.3.4  Inrush Current, Overcurrent, and Short-Circuit Protection
        1. 8.3.4.1 Slew Rate (dVdt) and Inrush Current Control
          1. 8.3.4.1.1 Start-Up Time Out
        2. 8.3.4.2 Steady-State Overcurrent Protection (Circuit-Breaker)
        3. 8.3.4.3 Active Current Limiting During Start-Up
        4. 8.3.4.4 Short-Circuit Protection
      5. 8.3.5  Analog Load Current Monitor (IMON)
      6. 8.3.6  Mode Selection (MODE)
      7. 8.3.7  Parallel Device Synchronization (SWEN)
      8. 8.3.8  Stacking Multiple eFuses for Unlimited Scalability
        1. 8.3.8.1 Current Balancing During Start-Up
      9. 8.3.9  Analog Junction Temperature Monitor (TEMP)
      10. 8.3.10 Overtemperature Protection
      11. 8.3.11 Fault Response and Indication (FLT)
      12. 8.3.12 Power-Good Indication (PG)
      13. 8.3.13 Output Discharge
      14. 8.3.14 FET Health Monitoring
      15. 8.3.15 Single Point Failure Mitigation
        1. 8.3.15.1 IMON Pin Single Point Failure
        2. 8.3.15.2 ILIM Pin Single Point Failure
        3. 8.3.15.3 IREF Pin Single Point Failure
        4. 8.3.15.4 ITIMER Pin Single Point Failure
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Single Device, Standalone Operation
      2. 9.1.2 Multiple Devices, Parallel Connection
      3. 9.1.3 Multiple eFuses, Parallel Connection With PMBus
      4. 9.1.4 Digital Telemetry Using External Microcontroller
    2. 9.2 Typical Application: 12-V, 3.3-kW Power Path Protection in Data Center Servers
      1. 9.2.1 Application
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
      4. 9.2.4 Application Curves
    3. 9.3 Best Design Practices
    4. 9.4 Power Supply Recommendations
      1. 9.4.1 Transient Protection
      2. 9.4.2 Output short-Circuit Measurements
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2.2 Design Requirements

Table 9-1 shows the design parameters for this application example.

Table 9-1 Design Parameters
PARAMETERVALUE
  • Input voltage range (VIN)
10.8 V – 13.2 V
  • Maximum DC load current (IOUT(max))
275 A
  • Maximum output capacitance (CLOAD)
50 mF
Are all the loads off until the PG is asserted?No

Load at start-up (RLOAD(Startup))

0.48 Ω (equivalent to approximately 10% of the maximum steady-state load)

Maximum ambient temperature

55°C

Transient overload blanking timer

16 ms

Output turn on (soft-start) time

10 ms

Output voltage slew rate

1.2 V/ms

Need to survive a “Hot-Short” on output condition ?

Yes

Need to survive a “power up into short” condition?

Yes

Can a board be hotplugged in or power cycled?

Yes

Load current monitoring needed?

Yes

Fault response

Latch-off