SLVSBE9E April   2012  – June 2015 TPS27081A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
      1. 6.6.1 PFET Q1 Minimum Safe Operating Area (SOA)
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 ON/OFF
      2. 7.4.2 Fastest Output Rise Time
      3. 7.4.3 Controlled Output Rise Time
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Standard Load Switching Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Configuring Q1 ON Resistance
          2. 8.2.1.2.2 Configuring Turnon Slew Rate
          3. 8.2.1.2.3 Configuring Turnoff Delay
          4. 8.2.1.2.4 Low Voltage ON/OFF Interface
          5. 8.2.1.2.5 ON-Chip Power Dissipation
        3. 8.2.1.3 Application Curves
    3. 8.3 System Examples
      1. 8.3.1 Standby Power Isolation
      2. 8.3.2 Boost Regulator With True Shutdown
      3. 8.3.3 Single Module Multiple Power Supply Sequencing
      4. 8.3.4 Multiple Modules Interdependent Power Supply Sequencing
      5. 8.3.5 TFT LCD Module Inrush Current Control
      6. 8.3.6 Multiple Modules Interdependent Supply Sequencing Without a GPIO Input
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Reliability
    4. 10.4 Improving Package Thermal Performance
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from D Revision (April 2013) to E Revision

  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go

Changes from C Revision (January 2013) to D Revision

  • Updated wording in document.Go

Changes from B Revision (September 2012) to C Revision

  • Removed DRV package preview from datasheet.Go