SLVSBE9E April   2012  – June 2015 TPS27081A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
      1. 6.6.1 PFET Q1 Minimum Safe Operating Area (SOA)
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 ON/OFF
      2. 7.4.2 Fastest Output Rise Time
      3. 7.4.3 Controlled Output Rise Time
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Standard Load Switching Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Configuring Q1 ON Resistance
          2. 8.2.1.2.2 Configuring Turnon Slew Rate
          3. 8.2.1.2.3 Configuring Turnoff Delay
          4. 8.2.1.2.4 Low Voltage ON/OFF Interface
          5. 8.2.1.2.5 ON-Chip Power Dissipation
        3. 8.2.1.3 Application Curves
    3. 8.3 System Examples
      1. 8.3.1 Standby Power Isolation
      2. 8.3.2 Boost Regulator With True Shutdown
      3. 8.3.3 Single Module Multiple Power Supply Sequencing
      4. 8.3.4 Multiple Modules Interdependent Power Supply Sequencing
      5. 8.3.5 TFT LCD Module Inrush Current Control
      6. 8.3.6 Multiple Modules Interdependent Supply Sequencing Without a GPIO Input
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Reliability
    4. 10.4 Improving Package Thermal Performance
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

Specified at TJ = –40°C to 105°C unless otherwise noted.(1)(5)
MIN MAX UNIT
VIN(max) VIN pin maximum voltage with reference to pin R2 –0.1 8 V
VOUT(max) VOUT pin maximum voltage with reference to pin R2 –0.1 8 V
VON/OFF ON/OFF in maximum voltage with respect to pin R2 –0.3 8 V
IQ1(on) Maximum continuous drain current of Q1 at TJ = 105°C 3 A
Maximum pulsed drain current of Q1 (2) at TJ = 105°C 9.5
PD Maximum power dissipation at TA = 25°C, TJ = 150°C, RθJA = 105°C/W 1190 mW
TA Operating free-air ambient temperature –40 85(4) °C
TJ(max)(3) Operating virtual junction temperature 150 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Pulse width <300 µs, duty cycle < 2%
(3) Operating at the absolute TJ(max) = 150°C can affect reliability. For higher reliability,TI recommends maintaining TJ < 105°C.
(4) TJ(max) limits and other related conditions apply. Refer to SOA charts, Figure 8 through Figure 12.
(5) Refer to TI’s design support web page at www.ti.com/thermal for improving device thermal performance.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VIN Input voltage 1 8 V
TA Operating free-air ambient temperature –40 85 °C
TJ Junction temperature –40 105 °C

6.4 Thermal Information

THERMAL METRIC(1) TPS27081A UNIT
DDC (SOT)
6 PINS
RθJA Junction-to-ambient thermal resistance 105 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 43 °C/W
RθJB Junction-to-board thermal resistance 17.8 °C/W
ψJT Junction-to-top characterization parameter 6.5 °C/W
ψJB Junction-to-board characterization parameter 16.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

Specified over the recommended junction temperature range TJ = –40°C to 105°C unless otherwise noted. Typical values specified at TA = TJ = 25°C.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
OFF-TIME CHARACTERISTICS
BVIN1 Q1 drain-to-source breakdown voltage VON/OFF = 0 V, VGS(Q1) = 0 V, ID(Q1) = 250 µA –8 V
ILOAD(5) VIN pin total leakage current VIN = 8 V, VON/OFF = 0 V, RR1 = 10 kΩ TJ = 25°C 0.15 0.75 µA
TJ = 85°C(3) 5 20
VIN = 5 V, VON/OFF = 0 V, RR1 = 10 kΩ TJ = 25°C 0.05
TJ = 85°C(3) 2
IFQ2 Q2 drain-to-source leakage current VIN = 8 V, VON/OFF = 0 V TJ = 25°C 0.03 0.05 µA
TJ = 85°C(3) 0.35 0.6
VIN = 5 V, VON/OFF = 0 V TJ = 25°C 0.025 µA
TJ = 85°C(3) 0.25
ON-TIME CHARACTERISTICS(1)
VIL ON/OFF pin low-level input voltage VIN = 5 V, ID(Q1) < 2 µA, RR1 = 10 kΩ, RR2 = RL = 0 Ω TJ = 25°C 0.3 V
VIN = 5 V, ID(Q1) < 20 µA,
RR1 = 10 kΩ, RR2 = RL = 0 Ω		 TJ = 85°C(3) 0.2
VIH ON/OFF pin high-level input voltage VIN = 5 V, RR1 = 10 kΩ 1 V
RQ1(on) Q1 Channel ON-resistance(4) VGS = –4.5 V, ID(Q1) = 3 A 32 55 mΩ
VGS = –3 V, ID(Q1) = 2.5 A 44 77
VGS = –2.5 V, ID(Q1) = 2.5 A 50 85
VGS = –1.8 V, ID(Q1) = 2 A 82 147
VGS = –1.5 V, ID(Q1) = 1 A 93 166
VGS = –1.2 V, ID(Q1) = 0.5 A 155 260
RQ2(on) Q2 Channel ON-resistance VGS = 4.5 V, ID(Q2) = 0.4 A 1.8 3 Ω
VGS = 3.0 V, ID(Q2) = 0.3 A 2.3 6.2
VGS = 2.5 V, ID(Q2) = 0.2 A 2.6 6.1
VGS = 1.8 V, ID(Q2) = 0.1 A 3.8 10
VGS = 1.5 V, ID(Q2) = 0.05 A 4.4 8.5
VGS = 1.2 V, ID(Q2) = 0.03 A 6.25 13.5
Q1 DRAIN-SOURCE DIODE PARAMETERS(1)(2)
IFSD Source-drain diode peak forward current VFSD = 0.8 V, VON/OFF = 0 V 1 A
VFSD Source-drain diode forward voltage VON/OFF = 0 V, IFSD = –0.6 A 1 V
(1) Pulse width < 300 µs, duty cycle < 2.0%
(2) Not rated for continuous current operation.
(3) Specified by design. Not production tested.
(4) Refer to PFET Q1 Minimum Safe Operating Area (SOA)section for current rating.
(5) Pullup resistor (RR1) dependent.

6.6 Typical Characteristics

TPS27081A tc1_lvsbe9.png
VGS(Q1) = –1.2 V
Figure 1. Drop Voltage vs Load Current
TPS27081A tc3_lvsbe9.png
VGS(Q1) = –2.5 V
Figure 3. Drop Voltage vs Load Current
TPS27081A tc4a_lvsbe9.png
VGS(Q1) = –4.5 V
Figure 5. Drop Voltage vs Load Current
TPS27081A tc4c_lvsbe9.png
VGS(Q1) = –7 V
Figure 7. Drop Voltage vs Load Current
TPS27081A tc2_lvsbe9.png
VGS(Q1) = –1.8 V
Figure 2. Drop Voltage vs Load Current
TPS27081A tc4_lvsbe9.png
VGS(Q1) = –3.3 V
Figure 4. Drop Voltage vs Load Current
TPS27081A tc4b_lvsbe9.png
VGS(Q1) = –5.5 V
Figure 6. Drop Voltage vs Load Current

6.6.1 PFET Q1 Minimum Safe Operating Area (SOA)

TPS27081A tc5_lvsbe9.png
VGS_Q1 = –4.5 V
Figure 8. Q1 Safe Operating Area
TPS27081A tc9_lvsbe9.png
VGS_Q1 = –2.5 V
Figure 10. Q1 Safe Operating Area
TPS27081A tc8_lvsbe9.png
VGS_Q1 = –1.2 V
Figure 12. Q1 Safe Operating Area
TPS27081A tc6_lvsbe9.png
VGS_Q1 = –3 V
Figure 9. Q1 Safe Operating Area
TPS27081A tc7_lvsbe9.png
VGS_Q1 = –1.8 V
Figure 11. Q1 Safe Operating Area