SLVSF24C december   2020  – may 2023 TPS272C45

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
    1. 6.1 Recommended Connections for Unused Pins
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 SNS Timing Characteristics
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  9. 8 Parameter Measurement Information
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Programmable Current Limit
        1. 9.3.1.1 Inrush Current Handling
        2. 9.3.1.2 Calculating RILIMx
        3. 9.3.1.3 Configuring ILIMx From an MCU
      2. 9.3.2 Low Power Dissipation
      3. 9.3.3 Protection Mechanisms
        1. 9.3.3.1 Short-Circuit Protection
          1. 9.3.3.1.1 VS During Short-to-Ground
        2. 9.3.3.2 Inductive Load Demagnetization
        3. 9.3.3.3 Thermal Shutdown
        4. 9.3.3.4 Undervoltage Lockout on VS (UVLO)
        5. 9.3.3.5 Undervoltage Lockout on Low Voltage Supply (VDD_UVLO)
        6. 9.3.3.6 Power-Up and Power-Down Behavior
        7. 9.3.3.7 Overvoltage Protection (OVPR)
      4. 9.3.4 Diagnostic Mechanisms
        1. 9.3.4.1 Current Sense
          1. 9.3.4.1.1 RSNS Value
            1. 9.3.4.1.1.1 Current Sense Output Filter
        2. 9.3.4.2 Fault Indication
          1. 9.3.4.2.1 Fault Event Diagrams
        3. 9.3.4.3 Short-to-Supply or Open-Load Detection
          1. 9.3.4.3.1 Detection With Switch Enabled
          2. 9.3.4.3.2 Detection With Switch Disabled
        4. 9.3.4.4 Current Sense Resistor Sharing
    4. 9.4 Device Functional Modes
      1. 9.4.1 Off
      2. 9.4.2 Diagnostic
      3. 9.4.3 Active
      4. 9.4.4 Fault
  11. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 IEC 61000-4-5 Surge
      2. 10.1.2 Inverse Current
      3. 10.1.3 Loss of GND
      4. 10.1.4 Paralleling Channels
      5. 10.1.5 Thermal Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 RILIM Calculation
        2. 10.2.2.2 Diagnostics
          1. 10.2.2.2.1 Selecting the RISNS Value
      3. 10.2.3 Application Curves
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1.2 Inverse Current

Inverse current occurs when 0 V < VVS < VOUT. In this case, current can flow from VOUT to VS. Inverse current cannot be caused by a purely resistive load. However, a capacitive or inductive load can cause inverse current. For example, if there is a significant amount of load capacitance and the VS node has a transient droop, VOUT can be greater than VS.

The TPS272C45 does not detect inverse current. When the switch is enabled, inverse current passes through the switch. When the switch is disabled, inverse current can pass through the MOSFET body diode. The device continues operating in the normal manner during an inverse current event.