SLVSF24C december   2020  – may 2023 TPS272C45

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
    1. 6.1 Recommended Connections for Unused Pins
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 SNS Timing Characteristics
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  9. 8 Parameter Measurement Information
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Programmable Current Limit
        1. 9.3.1.1 Inrush Current Handling
        2. 9.3.1.2 Calculating RILIMx
        3. 9.3.1.3 Configuring ILIMx From an MCU
      2. 9.3.2 Low Power Dissipation
      3. 9.3.3 Protection Mechanisms
        1. 9.3.3.1 Short-Circuit Protection
          1. 9.3.3.1.1 VS During Short-to-Ground
        2. 9.3.3.2 Inductive Load Demagnetization
        3. 9.3.3.3 Thermal Shutdown
        4. 9.3.3.4 Undervoltage Lockout on VS (UVLO)
        5. 9.3.3.5 Undervoltage Lockout on Low Voltage Supply (VDD_UVLO)
        6. 9.3.3.6 Power-Up and Power-Down Behavior
        7. 9.3.3.7 Overvoltage Protection (OVPR)
      4. 9.3.4 Diagnostic Mechanisms
        1. 9.3.4.1 Current Sense
          1. 9.3.4.1.1 RSNS Value
            1. 9.3.4.1.1.1 Current Sense Output Filter
        2. 9.3.4.2 Fault Indication
          1. 9.3.4.2.1 Fault Event Diagrams
        3. 9.3.4.3 Short-to-Supply or Open-Load Detection
          1. 9.3.4.3.1 Detection With Switch Enabled
          2. 9.3.4.3.2 Detection With Switch Disabled
        4. 9.3.4.4 Current Sense Resistor Sharing
    4. 9.4 Device Functional Modes
      1. 9.4.1 Off
      2. 9.4.2 Diagnostic
      3. 9.4.3 Active
      4. 9.4.4 Fault
  11. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 IEC 61000-4-5 Surge
      2. 10.1.2 Inverse Current
      3. 10.1.3 Loss of GND
      4. 10.1.4 Paralleling Channels
      5. 10.1.5 Thermal Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 RILIM Calculation
        2. 10.2.2.2 Diagnostics
          1. 10.2.2.2.1 Selecting the RISNS Value
      3. 10.2.3 Application Curves
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.3.3.3 Thermal Shutdown

The TPS272C45 includes a temperature sensor on the power FET and also within the controller portion of the device. The device registers a thermal shutdown fault:

  • TJ,FET > TABS

  • TJ,FET - TJ,control > TREL

After the fault is detected, the switch turns off. If TJ,FET passes TABS, the fault is cleared when the switch temperature decreases by the hysteresis value, THYS. If instead the TREL threshold is exceeded, the fault is cleared after TRETRY passes.

Each channel shuts down independently in case of a thermal event, as each has its own temperature sensor and fault reporting.