SLVSH35A October   2023  – February 2024 TPS274C65CP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Pin Diagrams
      2. 8.3.2 Programmable Current Limit
      3. 8.3.3 Protection Mechanisms
        1. 8.3.3.1 Over-current Protection
        2. 8.3.3.2 Short-Circuit Protection
          1. 8.3.3.2.1 VS During Short-to-Ground
        3. 8.3.3.3 Thermal Shutdown Behavior
        4. 8.3.3.4 Inductive-Load Switching-Off Clamp
        5. 8.3.3.5 Inductive Load Demagnetization
        6. 8.3.3.6 Thermal Shutdown
        7. 8.3.3.7 Undervoltage Protection on VS (UVP)
        8. 8.3.3.8 Undervoltage Lockout on Low Voltage Supply (VDD_UVLO)
        9. 8.3.3.9 Power-Up and Power-Down Behavior
      4. 8.3.4 Diagnostic Mechanisms
        1. 8.3.4.1 Fault Indication
        2. 8.3.4.2 Short-to-Battery and Open-Load Detection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Off
      2. 8.4.2 Active
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 IEC 61000-4-5 Surge
        2. 9.2.2.2 Loss of GND
        3. 9.2.2.3 Paralleling Channels
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2.1 Design Requirements

Table 9-1 Recommended External Components
COMPONENT TYPICAL VALUE PURPOSE
RPROT 5-10 kΩ Protect microcontroller and device I/O pins
RST 4.7 kΩ Open-drain pull-up resistor
RILIMx 13.3 kΩ to 110 kΩ Discrete value outlined in Table 8-1
CVin1 100 nF to System GND Stabilize the input supply and filter out low frequency noise
CVin2 4.7 nF to IC GND Filtering of voltage transients (for example, ESD, IEC 61000-4-5) and improved emissions
CVDD 2.2 uF to Module GND Stabilize the input supply and limit supply excursions.
COUT 22 nF Filtering of voltage transients (for example, ESD, RF transients)
ZTVS 36-V TVS Clamp surge voltages at the supply input
DGND Diode with < 0.7-V forward voltage drop Optional for reverse polarity protection - if needed
RGND

4.7 kΩ

Stabilize IC GND in the event of negative output swings when GND network is used