SLVSH35A October   2023  – February 2024 TPS274C65CP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Pin Diagrams
      2. 8.3.2 Programmable Current Limit
      3. 8.3.3 Protection Mechanisms
        1. 8.3.3.1 Over-current Protection
        2. 8.3.3.2 Short-Circuit Protection
          1. 8.3.3.2.1 VS During Short-to-Ground
        3. 8.3.3.3 Thermal Shutdown Behavior
        4. 8.3.3.4 Inductive-Load Switching-Off Clamp
        5. 8.3.3.5 Inductive Load Demagnetization
        6. 8.3.3.6 Thermal Shutdown
        7. 8.3.3.7 Undervoltage Protection on VS (UVP)
        8. 8.3.3.8 Undervoltage Lockout on Low Voltage Supply (VDD_UVLO)
        9. 8.3.3.9 Power-Up and Power-Down Behavior
      4. 8.3.4 Diagnostic Mechanisms
        1. 8.3.4.1 Fault Indication
        2. 8.3.4.2 Short-to-Battery and Open-Load Detection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Off
      2. 8.4.2 Active
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 IEC 61000-4-5 Surge
        2. 9.2.2.2 Loss of GND
        3. 9.2.2.3 Paralleling Channels
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)(2) TPS274C65X UNIT
RHA (VQFN)
40 PINS
RθJA Junction-to-ambient thermal resistance 25.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 15.8 °C/W
RθJB Junction-to-board thermal resistance 7.6 °C/W
ψJT Junction-to-top characterization parameter 0.2 °C/W
ψJB Junction-to-board characterization parameter 7.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 0.6 °C/W
(1) For more information about traditional and new thermal metrics, see the SPRA953 application report.
(2) The thermal parameters are based on a 4-layer PCB according to the JESD51-5 and JESD51-7 standards.