SNVSCF7 December   2022 TPS3435

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Timing Diagrams
    9. 7.9 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Timeout Watchdog Timer
        1. 8.3.1.1 tWD Timer
        2. 8.3.1.2 Watchdog Enable Disable Operation
        3. 8.3.1.3 tSD Watchdog Start Up Delay
        4. 8.3.1.4 SET Pin Behavior
      2. 8.3.2 Manual RESET
      3. 8.3.3 WDO Output
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Output Assert Delay
        1. 9.1.1.1 Factory-Programmed Output Assert Delay Timing
        2. 9.1.1.2 Adjustable Capacitor Timing
      2. 9.1.2 Watchdog Timer Functionality
        1. 9.1.2.1 Factory-Programmed Timing Options
        2. 9.1.2.2 Adjustable Capacitor Timing
    2. 9.2 Typical Applications
      1. 9.2.1 Design 1: Monitoring a Standard Microcontroller for Timeouts
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Setting the Watchdog Timeout Period
          2. 9.2.1.2.2 Setting Output Assert Delay
          3. 9.2.1.2.3 Setting the Startup Delay
          4. 9.2.1.2.4 Calculating the WDO Pullup Resistor
        3. 9.2.1.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) TPS3435 UNIT
DDF (SOT23-8)
8 PINS
RθJA Junction-to-ambient thermal resistance 175.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 94.7 °C/W
RθJB Junction-to-board thermal resistance 92.4 °C/W
ψJT Junction-to-top characterization parameter 8.4 °C/W
ψJB Junction-to-board characterization parameter 91.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.