SLVSGE8B November   2022  – August 2024 TPS35-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Timing Diagrams
    9. 6.9 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Voltage Supervisor
      2. 7.3.2 Timeout Watchdog Timer
        1. 7.3.2.1 tWD Timer
        2. 7.3.2.2 Watchdog Enable Disable Operation
        3. 7.3.2.3 tSD Watchdog Start Up Delay
        4. 7.3.2.4 SET Pin Behavior
      3. 7.3.3 Manual RESET
      4. 7.3.4 RESET and WDO Output
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 CRST Delay
        1. 8.1.1.1 Factory-Programmed watchdog Timing
        2. 8.1.1.2 Adjustable Capacitor Timing
      2. 8.1.2 Watchdog Timer Functionality
        1. 8.1.2.1 Factory-Programmed watchdog Timing
        2. 8.1.2.2 Adjustable Capacitor Timings
    2. 8.2 Typical Applications
      1. 8.2.1 Design 1: Monitoring a Microcontroller Supply Voltage and Watchdog Timer
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Setting the Voltage Threshold
          2. 8.2.1.2.2 Meeting the Watchdog Timeout Period
          3. 8.2.1.2.3 Setting the Reset Delay
          4. 8.2.1.2.4 Setting the Startup Delay and Output Topology
          5. 8.2.1.2.5 Calculating the RESET Pullup Resistor
        3. 8.2.1.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TPS35-Q1 UNIT
DDF (SOT23-8)
8 PINS
RθJA Junction-to-ambient thermal resistance 175.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 94.7 °C/W
RθJB Junction-to-board thermal resistance 92.4 °C/W
ψJT Junction-to-top characterization parameter 8.4 °C/W
ψJB Junction-to-board characterization parameter 91.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.