SNVSBD9E august   2020  – august 2023 TPS37-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Timing Diagrams
    8. 7.8 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input Voltage (VDD)
        1. 8.3.1.1 Undervoltage Lockout (VPOR < VDD < UVLO)
        2. 8.3.1.2 Power-On Reset (VDD < VPOR )
      2. 8.3.2 SENSE
        1. 8.3.2.1 SENSE Hysteresis
      3. 8.3.3 Output Logic Configurations
        1. 8.3.3.1 Open-Drain
        2. 8.3.3.2 Push-Pull
        3. 8.3.3.3 Active-High (RESET)
        4. 8.3.3.4 Active-Low (RESET)
      4. 8.3.4 User-Programmable Reset Time Delay
        1. 8.3.4.1 Reset Time Delay Configuration
      5. 8.3.5 User-Programmable Sense Delay
        1. 8.3.5.1 Sense Time Delay Configuration
      6. 8.3.6 Manual RESET (CTR1 / MR) and (CTR2 / MR) Input
  10. 9 Device Functional Modes
  11. 10Application and Implementation
    1. 10.1 Adjustable Voltage Thresholds
    2. 10.2 Application Information
    3. 10.3 Typical Application
      1. 10.3.1 Design 1: Automotive Off-Battery Monitoring
        1. 10.3.1.1 Design Requirements
        2. 10.3.1.2 Detailed Design Procedure
        3. 10.3.1.3 Application Curves
    4. 10.4 Power Supply Recommendations
      1. 10.4.1 Power Dissipation and Device Operation
    5. 10.5 Layout
      1. 10.5.1 Layout Guidelines
      2. 10.5.2 Layout Example
      3. 10.5.3 Creepage Distance
  12. 11Device and Documentation Support
    1. 11.1 Device Nomenclature
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC (1) TPS37-Q1 UNIT
DSK DYY
10-PIN 14-PIN
RθJA Junction-to-ambient thermal resistance 87.4 131.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 76.3 61.1 °C/W
RθJB Junction-to-board thermal resistance 54.2 56.6 °C/W
ψJT Junction-to-top characterization parameter 4.8 3.4 °C/W
ψJB Junction-to-board characterization parameter 54.2 56.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 34.8 N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.