SBVS251A January   2015  – February 2024 TPS3702

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Input (SENSE)
      2. 6.3.2 Outputs (UV, OV)
      3. 6.3.3 User-Configurable Accuracy Band (SET)
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation (VDD > UVLO)
      2. 6.4.2 Undervoltage Lockout (V(POR) < VDD < UVLO)
      3. 6.4.3 Power-On Reset (VDD < V(POR))
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Window Voltage Detector Considerations
      2. 7.1.2 Input and Output Configurations
      3. 7.1.3 Immunity to SENSE Pin Voltage Transients
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
  9. 8 Power Supply Recommendations
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
        1. 10.1.1.1 Evaluation Module
      2. 10.1.2 Device Nomenclature
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)TPS3702UNIT
DDC (SOT)
6 PINS
RθJAJunction-to-ambient thermal resistance201.6°C/W
RθJC(top)Junction-to-case (top) thermal resistance47.8°C/W
RθJBJunction-to-board thermal resistance51.2°C/W
ψJTJunction-to-top characterization parameter0.7°C/W
ψJBJunction-to-board characterization parameter50.8°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/A°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.