SNVSBS9C March   2021  – May 2024 TPS3704-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Nomenclature
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 VDD
      2. 7.3.2 SENSEx Input
        1. 7.3.2.1 Immunity to SENSEx Pins Voltage Transients
          1. 7.3.2.1.1 SENSEx Hysteresis
      3. 7.3.3 RESETx/RESETx
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation (VDD > VDD(MIN))
      2. 7.4.2 Undervoltage Lockout (VPOR < VDD < UVLO)
      3. 7.4.3 Power-On Reset (VDD < VPOR)
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Voltage Threshold Accuracy
      2. 8.1.2 Adjustable Voltage Thresholds
    2. 8.2 Typical Applications
      1. 8.2.1 Design 1: Multi-Rail Window Monitoring for Microcontroller Power Rails
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
      2. 8.2.2 Design 2: Manual Self-Test Option for Enhanced Functional Safety Use Cases
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Supply Guidelines
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8 Application and Implementation

Note:

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.