SNVSBS9C March   2021  – May 2024 TPS3704-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Nomenclature
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 VDD
      2. 7.3.2 SENSEx Input
        1. 7.3.2.1 Immunity to SENSEx Pins Voltage Transients
          1. 7.3.2.1.1 SENSEx Hysteresis
      3. 7.3.3 RESETx/RESETx
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation (VDD > VDD(MIN))
      2. 7.4.2 Undervoltage Lockout (VPOR < VDD < UVLO)
      3. 7.4.3 Power-On Reset (VDD < VPOR)
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Voltage Threshold Accuracy
      2. 8.1.2 Adjustable Voltage Thresholds
    2. 8.2 Typical Applications
      1. 8.2.1 Design 1: Multi-Rail Window Monitoring for Microcontroller Power Rails
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
      2. 8.2.2 Design 2: Manual Self-Test Option for Enhanced Functional Safety Use Cases
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Supply Guidelines
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Device Nomenclature
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • ASIL-A Functional Safety-Compliant
    • Development targeted for functional safety applications
    • Documentation to aid ISO 26262 system design
    • Systematic capability up to ASIL D
    • Hardware capability up to ASIL A
  • AEC-Q100 qualified for automotive applications
    • Device temperature grade 1: –40°C to +125°C
  • 1-4 channels for monitoring state-of-the art SOCs
    • High ±0.25% (typical) threshold accuracy
    • Configure each channel for Window, UV, or OV voltage monitoring
    • Programmable window tolerance [3% to 11% (typical*)] for each channel
    • Easy to use calculator tool for adjustable versions
    • Designed to monitor Core and GPIO rails of TI processors (AM26x, AM62x, TDA4)
  • Miniature solution with low power consumption
    • 5.5µA typical quiescent current
    • Compact 6 pin SOT-23 package (2.9mm x 1.6mm)
  • Additional Features
    • Built-in hysteresis to prevent false trip on RESET: 0.75% (typical)
    • 23 fixed time delay options (selectable from 20µs to 1200ms)
    • Open drain or push-pull output topology available