SNVSBZ2E March   2021  – December 2023 TPS3704

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Nomenclature
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 VDD
      2. 7.3.2 SENSEx Input
        1. 7.3.2.1 Immunity to SENSEx Pins Voltage Transients
          1. 7.3.2.1.1 SENSEx Hysteresis
      3. 7.3.3 RESETx/RESETx
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation (VDD > VDD(MIN))
      2. 7.4.2 Undervoltage Lockout (VPOR < VDD < UVLO)
      3. 7.4.3 Power-On Reset (VDD < VPOR)
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Voltage Threshold Accuracy
      2. 8.1.2 Adjustable Voltage Thresholds
    2. 8.2 Typical Application
      1. 8.2.1 Design 1: Multi-Rail Window Monitoring for Microcontroller Power Rails
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
      2. 8.2.2 Design 2: Manual Self-Test Option for Enhanced Functional Safety Use Cases
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Supply Guidelines
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4.1 Layout Guidelines

  • Place the external components as close to the device as possible. This configuration prevents parasitic errors from occurring.
  • Avoid using long traces for the VDD supply node. The VDD capacitor, along with parasitic inductance from the supply to the capacitor, can form an LC circuit and create ringing with peak voltages above the maximum VDD voltage.
  • Avoid using long traces of voltage to the sense pin. Long traces increase parasitic inductance and cause inaccurate monitoring and diagnostics.
  • If SENSEx capacitors (CSENSEx) are used, place the capacitors as close as possible to the SENSEx pins to further improve the noise immunity on the SENSEx pins. Placing a 10 nF to 100 nF capacitors between the SENSEx pins and GND can reduce the sensitivity to transient voltages on the monitored signal.
  • Do not run sensitive analog traces in parallel with digital traces. Avoid crossing digital and analog traces if possible, and only make perpendicular crossings when absolutely necessary.