SNVSCN2 September   2024 TPS37100-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Timing Requirements
    8. 6.8 Timing Diagrams
    9. 6.9 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Voltage (VDD)
        1. 7.3.1.1 Undervoltage Lockout (VPOR < VDD < UVLO)
        2. 7.3.1.2 Power-On Reset (VDD < VPOR )
      2. 7.3.2 SENSE
        1. 7.3.2.1 Adjustable Voltage Thresholds
        2. 7.3.2.2 SENSE Hysteresis
        3. 7.3.2.3 Reverse Polarity Protection
      3. 7.3.3 Output Logic Configurations
        1. 7.3.3.1 Open-Drain
        2. 7.3.3.2 Active-Low (OUT A and OUT B)
        3. 7.3.3.3 Latching
      4. 7.3.4 User-Programmable Release Time Delay
        1. 7.3.4.1 Deassertion Time Delay Configuration
      5. 7.3.5 User-Programmable Sense Delay
        1. 7.3.5.1 Sense Time Delay Configuration
      6. 7.3.6 Analog Out
      7. 7.3.7 Built-in Self-Test
        1. 7.3.7.1 Latching
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design 1: Off-Battery Monitoring
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Dissipation and Device Operation
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
      3. 8.4.3 Creepage Distance
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC (1) TPS3710x-Q1 UNIT
DYY
14-PIN
RθJA Junction-to-ambient thermal resistance 120.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 54.2 °C/W
RθJB Junction-to-board thermal resistance 50.1 °C/W
ψJT Junction-to-top characterization parameter 2.7 °C/W
ψJB Junction-to-board characterization parameter 49.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.