SBVS272B November   2015  – December 2023 TPS3711

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings #GUID-795AD25B-5DDA-4725-83BA-87F5B93DF96A/ABSMAXNOTE
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Input Pin (SENSE)
      2. 6.3.2 Output Pin (OUT)
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation (VDD > UVLO)
      2. 6.4.2 Undervoltage Lockout (V(POR) < VDD < UVLO)
      3. 6.4.3 Power On Reset (VDD < V(POR))
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Input and Output Configurations
      2. 7.1.2 Immunity to Input Pin Voltage Transients
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Resistor Divider Selection
        2. 7.2.2.2 Pullup Resistor Selection
        3. 7.2.2.3 Input Supply Capacitor
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC #TPS3711UNIT
DDC (SOT)
6 PINS
RθJAJunction-to-ambient thermal resistance201.6°C/W
RθJC(top)Junction-to-case (top) thermal resistance47.8°C/W
RθJBJunction-to-board thermal resistance51.2°C/W
ψJTJunction-to-top characterization parameter0.7°C/W
ψJBJunction-to-board characterization parameter50.8°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/A°C/W