SNVSCE6A October   2023  – May 2024 TPS3762-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Nomenclature
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Requirements
    7. 7.7 Timing Requirements
  9. 8 Timing Diagrams
  10. 9 Typical Characteristics
  11. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 Input Voltage (VDD)
        1. 10.3.1.1 Undervoltage Lockout (VPOR < VDD < UVLO)
        2. 10.3.1.2 Power-On Reset (VDD < VPOR )
      2. 10.3.2 SENSE
        1. 10.3.2.1 Reverse Polarity Protection
        2. 10.3.2.2 SENSE Hysteresis
      3. 10.3.3 Output Logic Configurations
        1. 10.3.3.1 Open-Drain
        2. 10.3.3.2 Active-Low (RESET)
        3. 10.3.3.3 Latching
        4. 10.3.3.4 UVBypass
      4. 10.3.4 User-Programmable Reset Time Delay
        1. 10.3.4.1 Reset Time Delay Configuration
      5. 10.3.5 User-Programmable Sense Delay
        1. 10.3.5.1 Sense Time Delay Configuration
      6. 10.3.6 Built-In Self-Test
    4. 10.4 Device Functional Modes
  12. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Adjustable Voltage Thresholds
    3. 11.3 Typical Application
      1. 11.3.1 Design 1: Off-Battery Monitoring
        1. 11.3.1.1 Design Requirements
        2. 11.3.1.2 Detailed Design Procedure
          1. 11.3.1.2.1 Setting Voltage Threshold
          2. 11.3.1.2.2 Meeting the Sense and Reset Delay
          3. 11.3.1.2.3 Setting Supply Voltage
          4. 11.3.1.2.4 Initiating Built-In Self-Test and Clearing Latch
        3. 11.3.1.3 Application Curves
    4. 11.4 Power Supply Recommendations
      1. 11.4.1 Power Dissipation and Device Operation
    5. 11.5 Layout
      1. 11.5.1 Layout Guidelines
      2. 11.5.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  14. 13Revision History
  15. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.5.1 Layout Guidelines

  • Make sure that the connection to the VDD pin is low impedance. Good analog design practice is to place a greater than 0.1µF ceramic capacitor as near as possible to the VDD pin.
  • To further improve the noise immunity on the SENSE pins, placing a 10nF to 100nF capacitor between the SENSE pin and GND can reduce the sensitivity to transient voltages on the monitored signal.
  • If a capacitor is used on CTS or CTR, place these components as close as possible to the respective pins. If the capacitor adjustable pins are left unconnected, make sure to minimize the amount of parasitic capacitance on the pins to less than 5pF.
  • Place the pull-up resistors on RESET as close to the pin as possible.
  • When laying out metal traces, separate high voltage traces from low voltage traces as much as possible. If high and low voltage traces need to run close by, spacing between traces must be greater than 20mils (0.5mm).
  • Do not have high voltage metal pads or traces closer than 20 mils (0.5mm) to the low voltage metal pads or traces.