SNVSCM8A October   2023  – December 2023 TPS3762

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Specifications
    2. 6.2 Absolute Maximum Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Requirements
    7. 6.7 Timing Requirements
    8. 6.8 Timing Diagrams
    9. 6.9 Typical Characteristic
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Voltage (VDD)
        1. 7.3.1.1 Undervoltage Lockout (VPOR < VDD < UVLO)
        2. 7.3.1.2 Power-On Reset (VDD < VPOR )
      2. 7.3.2 SENSE
        1. 7.3.2.1 Reverse Polarity Protection
        2. 7.3.2.2 SENSE Hysteresis
      3. 7.3.3 Output Logic Configurations
        1. 7.3.3.1 Open-Drain
        2. 7.3.3.2 Active-Low (RESET)
        3. 7.3.3.3 Latching
      4. 7.3.4 User-Programmable Reset Time Delay
        1. 7.3.4.1 Reset Time Delay Configuration
      5. 7.3.5 User-Programmable Sense Delay
        1. 7.3.5.1 Sense Time Delay Configuration
      6. 7.3.6 Built-In Self-Test
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Adjustable Voltage Thresholds
    3. 8.3 Typical Application
      1. 8.3.1 Design 1: SELV Power Supply Monitoring
        1. 8.3.1.1 Design Requirements
        2. 8.3.1.2 Detailed Design Procedure
          1. 8.3.1.2.1 Setting Voltage Threshold
          2. 8.3.1.2.2 Meeting the Sense and Reset Delay
          3. 8.3.1.2.3 Setting Supply Voltage
          4. 8.3.1.2.4 Initiating Built-In Self-Test and Clearing Latch
        3. 8.3.1.3 Application Curves
    4. 8.4 Power Supply Recommendations
      1. 8.4.1 Power Dissipation and Device Operation
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.5 Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.